solder interconnect Latest Research Papers

Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability

Journal of Electronic Materials ◽

10.1007/s11664-021-09379-5 ◽

2022 ◽

Author(s):

Gihan Dodanduwa Waduge ◽

Greg Baty ◽

Young-woo Lee ◽

Tae-Kyu Lee

Keyword(s):

Isothermal Aging ◽

Aging Effect ◽

Shear Stability ◽

Solder Interconnect

Study of solder interconnect configurations and performance of vertical laser assisted assembled “3.5D” packages

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00302 ◽

2020 ◽

Author(s):

Andrej Kolbasow ◽

Matthias Fettke ◽

Timo Kubsch ◽

Vinith Bejugam ◽

Thorsten Teutsch

Keyword(s):

Solder Interconnect ◽

And Performance

Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life

Microelectronics Reliability ◽

10.1016/j.microrel.2020.113651 ◽

2020 ◽

Vol 109 ◽

pp. 113651

Author(s):

Deng Yun Chen ◽

Michael Osterman ◽

Abhijit Dasgupta

Keyword(s):

Fatigue Life ◽

Temperature Cycling ◽

Solder Interconnect ◽

Silver Copper ◽

Tin Silver Copper

Solder interconnect degradation with irregular joint shape

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2019.8724557 ◽

2019 ◽

Author(s):

X.J. Zhao ◽

H. De Vries ◽

R. Engelen ◽

P. Watte ◽

G. van Hees

Keyword(s):

Solder Interconnect ◽

Joint Shape

Time Integration Damage Model for Sn3.5Ag Solder Interconnect in Power Electronic Module

IEEE Transactions on Device and Materials Reliability ◽

10.1109/tdmr.2019.2891949 ◽

2019 ◽

Vol 19 (1) ◽

pp. 140-148

Author(s):

Pushpa Rajaguru ◽

Hua Lu ◽

Chris Bailey

Keyword(s):

Damage Model ◽

Time Integration ◽

Power Electronic ◽

Solder Interconnect

Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect

Microelectronics Reliability ◽

10.1016/j.microrel.2018.11.006 ◽

2019 ◽

Vol 92 ◽

pp. 12-19 ◽

Cited By ~ 7

Author(s):

Ze Zhu ◽

Yan-cheong Chan ◽

Fengshun Wu

Keyword(s):

Mechanical Properties ◽

Silver Content ◽

Alternating Current ◽

Solder Interconnect ◽

Microstructure And Mechanical Properties

Rapid Solder Interconnect Fatigue Life Test Methodology for Predicting Thermomechanical Reliability

IEEE Transactions on Device and Materials Reliability ◽

10.1109/tdmr.2018.2851541 ◽

2018 ◽

Vol 18 (3) ◽

pp. 412-421 ◽

Cited By ~ 9

Author(s):

Cody J. Marbut ◽

Mahsa Montazeri ◽

David R. Huitink

Keyword(s):

Fatigue Life ◽

Life Test ◽

Solder Interconnect ◽

Test Methodology ◽

Thermomechanical Reliability ◽

Fatigue Life Test

Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy

2018 7th Electronic System-Integration Technology Conference (ESTC) ◽

10.1109/estc.2018.8546440 ◽

2018 ◽

Author(s):

Zhaoxia Zhou ◽

Li Liu ◽

Changqing Liu

Keyword(s):

Electron Microscopy ◽

Thermal Stability ◽

High Temperature ◽

Solder Interconnect ◽

In Situ Electron Microscopy ◽

Free Solder ◽

Thermal Stability Of

Challenges in Predicting the Solder Interconnect Lifetime of High Power Electronics

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480803 ◽

2018 ◽

Author(s):

X. Zhao ◽

Piet Watte ◽

Hans de Vries ◽

Ger van Hees

Keyword(s):

Power Electronics ◽

High Power ◽

Solder Interconnect

Wetting characterization of Flip chip’s Lead-Free Solder Interconnect Using Surface Evolver.

Journal of Physics Conference Series ◽

10.1088/1742-6596/1082/1/012055 ◽

2018 ◽

Vol 1082 ◽

pp. 012055

Author(s):

S.F. Lim ◽

M.S. Nurulakmal

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Surface Evolver ◽

Solder Interconnect ◽

Free Solder

solder interconnect
Recently Published Documents

TOTAL DOCUMENTS

H-INDEX

Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability

Study of solder interconnect configurations and performance of vertical laser assisted assembled “3.5D” packages

Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life

Solder interconnect degradation with irregular joint shape

Time Integration Damage Model for Sn3.5Ag Solder Interconnect in Power Electronic Module

Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect

Rapid Solder Interconnect Fatigue Life Test Methodology for Predicting Thermomechanical Reliability

Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy

Challenges in Predicting the Solder Interconnect Lifetime of High Power Electronics

Wetting characterization of Flip chip’s Lead-Free Solder Interconnect Using Surface Evolver.

Export Citation Format

solder interconnectRecently Published Documents

TOTAL DOCUMENTS

H-INDEX

Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability

Study of solder interconnect configurations and performance of vertical laser assisted assembled “3.5D” packages

Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life

Solder interconnect degradation with irregular joint shape

Time Integration Damage Model for Sn3.5Ag Solder Interconnect in Power Electronic Module

Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect

Rapid Solder Interconnect Fatigue Life Test Methodology for Predicting Thermomechanical Reliability

Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy

Challenges in Predicting the Solder Interconnect Lifetime of High Power Electronics

Wetting characterization of Flip chip’s Lead-Free Solder Interconnect Using Surface Evolver.

solder interconnect
Recently Published Documents