Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

2019 ◽  
Vol 304 (11) ◽  
pp. 1900310
Author(s):  
Guangyu Duan ◽  
Yan Wang ◽  
Junrong Yu ◽  
Jing Zhu ◽  
Zuming Hu
2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Zhengdong Wang ◽  
Guodong Meng ◽  
Liangliang Wang ◽  
Liliang Tian ◽  
Siyu Chen ◽  
...  

AbstractDielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synergistic effect and interface on through-plane thermal conductivity and dielectric properties by intercalating the hybrid fillers of the alumina and boron nitride nanosheets (BNNs) into epoxy resin. For instance, epoxy composite with hybrid fillers at a relatively low loading shows an increase of around 3 times in through-plane thermal conductivity and maintains a close dielectric breakdown strength compared to pure epoxy. Meanwhile, the epoxy composite shows extremely low dielectric loss of 0.0024 at room temperature and 0.022 at 100 ℃ and 10−1 Hz. And covalent bonding and hydrogen-bond interaction models were presented for analyzing the thermal conductivity and dielectric properties.


2018 ◽  
Vol 8 (1) ◽  
Author(s):  
Ting Wang ◽  
Mengjie Wang ◽  
Li Fu ◽  
Zehui Duan ◽  
Yapeng Chen ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document