Interface reaction‐induced separated phase structure in compatible epoxy thermosetting blending for unexpected mechanical properties and multi‐thermosensitive devices

2021 ◽  
Author(s):  
Li Yuan ◽  
Song Chen ◽  
Zehao Wang ◽  
Aijuan Gu ◽  
Guozheng Liang
2009 ◽  
Vol 517 (17) ◽  
pp. 4830-4834 ◽  
Author(s):  
Jun Zhang ◽  
Wenying Guo ◽  
Yu Zhang ◽  
Qiang Guo ◽  
Chuang Wang ◽  
...  

2020 ◽  
Vol 34 (08) ◽  
pp. 2050064 ◽  
Author(s):  
Meng Zhao ◽  
Liang Zhang ◽  
Lei Sun ◽  
Ming-yue Xiong ◽  
Nan Jiang ◽  
...  

In this study, the effects of Cu nanoparticles on the melting characteristics, wettability, interfacial reaction and mechanical properties of [Formula: see text]–[Formula: see text] [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text] composite solders were investigated. Results show that the properties of the composite solder containing Cu nanoparticles were improved effectively. With the addition of Cu nanoparticles, the melting point of [Formula: see text]–[Formula: see text] solder decreased significantly, and the spreading area and the shear strength were increased by 10.3% and 23.2%, respectively. For the performance, the optimal addition of Cu nanoparticles was 0.7%. In addition, the growth of interfacial intermetallic compounds in [Formula: see text]–[Formula: see text] solder joints was inhibited by adding Cu nanoparticles.


Polymer ◽  
2007 ◽  
Vol 48 (21) ◽  
pp. 6395-6403 ◽  
Author(s):  
Yongyan Pang ◽  
Xia Dong ◽  
Ying Zhao ◽  
Charles C. Han ◽  
Dujin Wang

2007 ◽  
Vol 67 (14) ◽  
pp. 2997-3005 ◽  
Author(s):  
Chuan Guo Ma ◽  
Yu Liang Mai ◽  
Min Zhi Rong ◽  
Wen Hong Ruan ◽  
Ming Qiu Zhang

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