Interface Reactions Responsible for Run-Out in Active Brazing: Part 4

This study examined the interface reaction between Ag-xAl filler metals having x = 0.2, 0.5, or 1.0 wt-% and Kovar™ base materials. The present investigation used the braze joint test sample configuration. The brazing conditions were 965°C (1769°F), 5 min; 995°C (1823°F), 20 min, and a vacuum of 10–7 Torr. Run-out was absent from all test samples. Combining these results with those of the Part 2 study that used high-Al, Ag-xAl filler metals (x = 2.0, 5.0, and 10 wt-%) established these conditions for run-out: Ag-xAl filler metals having x ≥ 2.0 wt-% Al, which result in reaction layer compositions, and (Fe, Ni, Co)y Alz , having z ≥ 26 at.-% Al. The limited occurrences of run-out lobes resulted from the surface tension effect that quickly reduced the driving force for additional run-out events. The interface reactions were controlled by a driving force that was an expressed function of filler metal composition (Ag-xAl) and brazing temperature, as opposed to simply thermally activated rate kinetics. The differences of reaction layer composition and thickness confirmed that the interface reactions differed between the braze joint and sessile drop configurations. Collectively, the findings from the Parts 1–4 investigations concluded that the most-effective means to mitigate run-out is to place a barrier coating on the Kovar base material that will prevent formation of the (Fe, Ni, Co)y Alz reaction layer.

Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish

Electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) is a common surface finish in electronic packaging, while the Ni(P) layer increases the impedance of solder joints and leads to signal quality degradation in high-frequency circuits. Reducing the thickness of the Ni(P) layer can balance the high impedance and weldability. In this paper, the interfacial reaction process between ultrathin ENEPIG substrates with different Ni layer thicknesses (0.112 and 0.185 μm) and Sn–3.0Ag–0.5Cu (SAC305) solder during reflow and aging was studied. The bonding ability and reliability of solder joints with different surface finishes were evaluated based on solder ball shear test, drop test and temperature cycle test (TCT), and the failure mechanism was analyzed from the perspective of intermetallic compound (IMC) interface growth. The results showed that the Ni–Sn–P layer generated by ultrathin ENEPIG can inhibit the growth of brittle IMC so that the solder joints maintain high shear strength. Ultrathin ENEPIG with a Ni layer thickness of 0.185 μm had no failure cracks under thermal cycling and drop impact, which can meet actual reliability standards. Therefore, ultrathin ENEPIG has broad prospects and important significance in the field of high-frequency chip substrate design and manufacturing.

Interface Reaction between Molten Al99.7 Aluminum Alloy and Various Tool Steels

During the die-casting process as well as the hot forming process, the tool is subjected to complex thermal, mechanical, and chemical stresses that can cause various types of damage to different parts of the tool. This study was carried out to determine the resistance of various tool steels, i.e., UTOPMO1, HTCS-130, and W600, in molten Al99.7 aluminum alloy at a temperature of 700 °C. The formation kinetics of the interaction layer between the molten aluminum and tool steels was studied using differential scanning calorimetry. Light and field-emission scanning electron microscopy were used to analyze the thickness and nature of the interaction layers, while thermodynamic calculations using the Thermo-Calc software were used to explain the results. The stability of the HTCS-130 and W600 tool steels is better than the stability of the UTOPMO1 tool steel in the molten Al99.7 aluminum. Two interaction layers were formed, which in all cases indicate an intermetallic Al13Fe4 layer near the aluminum alloy and an intermetallic Al5Fe2 layer near the tool steels, containing small round carbides. It was confirmed that Ni reduces the activity of aluminum in the ferrite matrix and causes a reduction in the thickness of the intermetallic layer.

Interface Reactions Responsible for Run-Out in Active Brazing: Part 3

This study examined the interface reaction between sessile drops of the Ag-xAl filler metals having x = 0.2, 0.5, and 1.0 wt-% and KovarTM base material as an avenue to understand the run-out phenomenon observed in active filler metal braze joints. The brazing conditions were combinations of 965°C (1769°F) and 995°C (1823°F) temperatures and brazing times of 5 and 20 min. All brazing was performed in a vacuum of 10–7 Torr. Microanalysis confirmed that a reaction layer developed ahead of the filler metal to support spontaneous wetting and spreading activity. However, run-out was not observed with the sessile drops because the additional surface energy created by the sessile drop free surface constrained wetting and spreading. The value of z in the reaction layer composition, (Fe, Ni, Co)yAlz, increased with x of the Ag-xAl sessile drops for both brazing conditions. Generally, the values of z were lower for the more severe brazing conditions. Also, the reaction layer thickness increased with the Al concentration in the filler metal but did not increase with the severity of brazing conditions. These behaviors indicate that the interface reaction was controlled by the chemical potential rather than the rate kinetics of a thermally activated process. The determining metrics were filler metal composition (Ag-xAl) and brazing temperature. The findings of the present study provided several insights toward developing potential mitigation strategies to prevent run-out.

Effect of Electric Pulse Treatment on Hot-Dip Aluminizing Coating of Ductile Iron

In this paper, hot-dip aluminizing of ferrite nodular cast iron was carried out after treating liquid aluminum with different electrical pulse parameters. Compared with that of conventional hot-dip aluminizing, the coating structure of the treated sample did not change, the surface was smooth and continuous, and the solidification structure was more uniform. When high voltage and large capacitance were used to treat the liquid aluminum, the thickness and compactness of the coating surface layer increased. The thickness of the alloy layer decreased, and, the compactness and the micro hardness increased, so the electric pulse had a certain inhibition on the formation of the alloy layer. The growth kinetics of the alloy layer showed that the rate-time index decreased from 0.60 for the conventional sample to 0.38 for the electric pulse treated sample. The growth of the alloy layer was controlled by diffusion and interface reaction, but only by diffusion. The AC impedance and polarization curves of the coating showed that the corrosion resistance of hot-dip coating on nodular cast iron was improved by electric pulse treatment.