Effects of nanoparticles on properties and interface reaction of Sn solder for microelectronic packaging

2020 ◽  
Vol 34 (08) ◽  
pp. 2050064 ◽  
Author(s):  
Meng Zhao ◽  
Liang Zhang ◽  
Lei Sun ◽  
Ming-yue Xiong ◽  
Nan Jiang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Melting Point ◽  
Composite Solder ◽  
Interface Reaction ◽  
Microelectronic Packaging ◽  
Cu Nanoparticles ◽  
Spreading Area ◽  
Melting Characteristics ◽  
Interfacial Intermetallic Compounds

In this study, the effects of Cu nanoparticles on the melting characteristics, wettability, interfacial reaction and mechanical properties of [Formula: see text]–[Formula: see text] [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text] composite solders were investigated. Results show that the properties of the composite solder containing Cu nanoparticles were improved effectively. With the addition of Cu nanoparticles, the melting point of [Formula: see text]–[Formula: see text] solder decreased significantly, and the spreading area and the shear strength were increased by 10.3% and 23.2%, respectively. For the performance, the optimal addition of Cu nanoparticles was 0.7%. In addition, the growth of interfacial intermetallic compounds in [Formula: see text]–[Formula: see text] solder joints was inhibited by adding Cu nanoparticles.

scholarly journals The Effect of Welding Speed on the Micromorphology and Mechanical Properties of Laser-Sealed Vacuum Flat Glazing Joints

2019 ◽  
Vol 2019 ◽  
pp. 1-5
Author(s):  
Hong Miao ◽  
Chong Li ◽  
Qiang He ◽  
Shanwen Zhang ◽  
Yanjun Zhang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Shear Strength ◽  
Welding Speed ◽  
Theoretical Basis ◽  
Interface Reaction ◽  
Input Energy ◽  
Wetting Layer ◽  
Vacuum Glazing ◽  
Sealing Layer

To explore the effect of welding speed on the micromorphology and mechanical properties of the laser-welded vacuum plate glazing joints, this paper introduced the research status of the laser welding vacuum glazing and then carried out the preparation for experimental materials. This paper also analyzed the microstructure, the cause of the pores, and the mechanical properties of the sealing layer. The results show that the smaller the welding speed is, the more fully the solder melts. When the welding speed is 80 mm/min, the sealing layer generates the large thermal stress due to excessive laser input energy, which results in many connected cracks in the sealing layer. The porosity of the sealing layer increases with the increase of the welding speed. The thickness of the interface reaction wetting layer decreases with the increase of the welding speed. The hardness, tensile strength, and shear strength of the sealing layer will increase first and then decrease with the increase of welding speed. These studies can provide the theoretical basis for laser sealing manufacturing of vacuum plate glazing.

Effect of the Content of Cu on Solderability and Mechanical Properties of Bi5Sb Solder Alloy

2009 ◽  
Vol 610-613 ◽  
pp. 537-541 ◽  
Author(s):  
Yan Fu Yan ◽  
Li Fang Feng ◽  
Xiao Xiao Guo ◽  
Kun Tang ◽  
Ke Xing Song
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
High Temperature ◽  
Melting Point ◽  
Solder Alloy ◽  
Ternary Alloy ◽  
Spreading Area ◽  
The Matrix ◽  
Difficult Subject ◽  
High Temperature Solder

It is a difficult subject to develop the high temperature solder with thewhose melting point is within 250～450°C in solder field. Bi5Sb solder alloy whosewith the melting point of about is about 280°C is limited for itshas bad solderability and mechanical properties. In the present work, the new BiSbCu ternary alloy wasis preparformed by adding different contents of Cu to Bi5Sb solder alloy to improve its solderability and mechanical properties. Results showed that the effect of adding 0.5～5.0％Cu into Bi-5Sb on the melting point of Bi5Sb solder alloy wais not distinct , but its solderability and mechanical properties weare markedly improved. Compared to the matrix of Bi5Sb, the spreading area of solder alloy wais about 57.8% largbigger and the tensile strength wais about 212.4% highbigger when the content of Cu wais 1.5wt.%. Analysis of tThe microstructure showeds that the needle-like Cu2Sb gradually becaomes shorter and dense along with the increasing of the content of Cu, which can effectaffected the properties of the solder alloy.

scholarly journals Influences of Sn on Properties of Ag-Based and Cu-Based Brazing Filler Metals

Crystals ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 1403
Author(s):  
Qingcheng Luo ◽  
Songbai Xue ◽  
Jie Wu
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Research And Development ◽  
Research Progress ◽  
Metallic Materials ◽  
Gap Filling ◽  
Industrial Manufacturing ◽  
Melting Characteristics ◽  
Almost All ◽  
Filler Metals

Ag-based and Cu-based brazing filler metals, which are the most widely used brazing materials in industrial manufacturing, have excellent gap-filling properties and can braze almost all the metallic materials and their alloys, except for the low-melting-point metals such as Al and Mg. Therefore, Ag-based and Cu-based brazing filler metals have attracted great attention. In this review, three series of typical Ag-based filler metals: the Ag-Cu, Ag-Cu-Zn, and Ag-Cu-Zn-Sn alloys; and three series of Cu-based filler metals: the crystalline and amorphous Cu-P filler metals, as well as the Cu-Zn filler metals, were chosen as the representatives. The latest research progress on Sn-containing Ag-based and Cu-based brazing filler metals is summarized, and the influences of Sn on the melting characteristics, wettability, microstructure, and mechanical properties of the selected filler metals are analyzed. Based on these, the problems and corresponding solutions in the investigation and application of the Sn-containing Ag-based and Cu-based filler metals are put forward, and the research and development trends of these filler metals are proposed.

Wettability and Shear Strength of Sn-Cu-Ni-xSi3N4 Composite Solder

2016 ◽  
Vol 700 ◽  
pp. 152-160 ◽  
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
R.M. Said ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Contact Angle ◽  
Shear Strength ◽  
Silicon Nitride ◽  
Fracture Surface ◽  
Composite Solder ◽  
Thickness Measurement ◽  
Contact Angle Measurement ◽  
Angle Measurement ◽  
Joint Fracture

The wettability and mechanical properties of solder the joint of Sn-Cu-Ni-xSi3N4 had been investigated. In this study, five different silicon nitride (Si3N4) percentage addition were chosen (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %). Contact angle measurement demonstrated that with Si3N4 addition, the wetting perfomances had been improved with the decrease of wettability contact angle. It is believed that the Si3N4 particles suppresses the interfacial IMC growth and thus improves the shear strength. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of Si3N4), the higher the shear strength of the joint. Fracture surface of sheared samples shows a combination of both brittle and ductile fracture.

Effect of in Addition to Zn-5Al Solder on Microstructure and Properties of Solder Joints

2016 ◽  
Vol 723 ◽  
pp. 357-362
Author(s):  
Igor Kostolný ◽  
Roman Koleňák
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Melting Point ◽  
Grain Boundary ◽  
Solder Joints ◽  
Intermetallic Phases ◽  
Interfacial Microstructure ◽  
Joint Interface ◽  
Interface Segregation ◽  
Cu And Zn

The effect of In addition to Zn-5Al on the interfacial reaction behaviors and mechanical properties of solder joints were investigated. It was found that addition of In decreasing the melting point of Zn-5Al solder. The segregation of In on grain boundary was observed. CuZn5 and Cu5Zn8 intermetallic phases were observed at joint interface. Segregation of In on grain boundary caused a significant decrease of strength of the Zn-5Al-In solder compared to Zn-5Al. Addition of 1% In to Zn-5Al solder resulted in a reduction of shear strength of 14 MPa. The interfacial microstructure, shear strength and fracture surfaces of Zn-5Al/Cu and Zn-5Al-1In/Cu solder joints were studied.

Effect of Ti Addition to Zn Filler Metal on Wettability and Reinforcement of Soldered Joint of Aluminum

2013 ◽  
Vol 211 ◽  
pp. 23-30
Author(s):  
Maciej Różański ◽  
Janusz Adamiec
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Melting Point ◽  
Structural Investigation ◽  
Filler Metal ◽  
Strength Test ◽  
Structural Examination ◽  
Shear Strength Test ◽  
Soldered Joint ◽  
Ti Addition

This article presents the phisicochemical propreties of aluminium brings a lot of difficulties during soldering one of tchem is low melting point. The work also presents results of mechanical and metallographic investigations. Structural examination was performed by means of light microscopy and mechanical properties with the aim of shear strength test. On the basis structural investigation joints made with Zn and Zn with Ti addition indicated possibilities of reinforcement of soldered joint of aluminium

scholarly journals Effect of Various Nanoparticles (GaF3, ZnF2, Zn(BF4)2 and Ga2O3) Additions on the Activity of CsF-RbF-AlF3 Flux and Mechanical Behavior of Al/Steel Brazed Joints

Crystals ◽  
2020 ◽  
Vol 10 (8) ◽  
pp. 683 ◽  
Author(s):  
Zhen Yao ◽  
Songbai Xue ◽  
Junxiong Zhang
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Aluminum Alloy ◽  
Interfacial Tension ◽  
Filler Metal ◽  
Spreading Area ◽  
Comparative Tests ◽  
Brazed Joints ◽  
In Virtue Of ◽  
Maximum Spreading

In this study, brazing AA6061 to Q235 steel using flame brazing was performed with 70.9 wt.% CsF-0.5 wt.% RbF-28.6 wt.% AlF3 fluxes doped with GaF3, ZnF2, Zn(BF4)2 and Ga2O3 nanoparticles, matched with a Zn-15Al filler metal, and the spreadability of the filler metal and the mechanical properties of brazed joints were investigated at the same time. The results showed suitable amounts of GaF3, ZnF2, Zn(BF4)2 and Ga2O3 doped into the base flux could strengthen the filler metal in wetting and spreading on the surface of aluminum alloy and steel to different degrees. The suitable ranges of GaF3, ZnF2, Zn(BF4)2 and Ga2O3, respectively, were 0.0075–0.01 wt.%, 0.0075–0.01 wt.%, 0.0075–0.01 wt.% and 0.009–0.01 wt.%, and the maximum spreading area was obtained via doping with GaF3. The shear strength of brazed joints reached the peak at 126 MPa when 0.075 wt.% GaF3 was added. Comparative tests proved that the activity of the CsF-RbF-AlF3 flux doped with GaF3 was the best. The reason was that the CsF-RbF-AlF3-GaF3 flux was competent in removing oxides of the base metal and decreasing the interfacial tension, in virtue of the activity of Ga3+ as well as F−.

scholarly journals Microstructures and Mechanical Properties of Mg-9Al/Ti Metallurgical Bonding Prepared by Liquid-Solid Diffusion Couples

Metals ◽  
2018 ◽  
Vol 8 (10) ◽  
pp. 778 ◽  
Author(s):  
Jiahong Dai ◽  
Bin Jiang ◽  
Qiong Yan ◽  
Hongmei Xie ◽  
Zhongtao Jiang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Shear Strength ◽  
Treatment Time ◽  
Interface Reaction ◽  
Heat Treatment Time ◽  
Diffusion Couples ◽  
Solid Diffusion ◽  
Metallurgical Bonding ◽  
Microstructures And Mechanical Properties

Microstructures and mechanical properties of Mg-9Al/Ti metallurgical bonding prepared by liquid-solid diffusion couples were investigated. The results indicate that a metallurgical bonding was formed at the interface Mg-9Al/Ti, and the Mg17Al12 phase growth coarsening at the interfaces with the increase in heat treatment time. Push-out testing was used to investigate the shear strength of the Mg-9Al/Ti metallurgical bonding. It is shown that the shear strength presents an increasing tendency with the increased heat treatment time. The sequence is characterized, and the results show that the fracture takes place along the Mg-9Al matrix at the interface. The diffusion of Al and Ti elements play a dominant role in the interface reaction of Mg-9Al/Ti metallurgical bonding. By energy-dispersive spectroscopy (EDS), X-ray diffraction (XRD) and thermodynamic analysis, it was found that Al3Ti is the only intermetallic compound at the interface of Mg-9Al/Ti metallurgical bonding. These results clearly show that chemical interaction at the interface formation of Al3Ti improves the mechanical properties of Mg-9Al/Ti metallurgical bonding.

Fabrication and Properties of Sn-3.5Ag-XCu Solder by Ball Milling and Paste Mixing

2012 ◽  
Vol 326-328 ◽  
pp. 12-17 ◽  
Author(s):  
Aemi Nadia ◽  
A.S.M.A. Haseeb
Keyword(s):  
Melting Point ◽  
Ball Milling ◽  
Room Temperature ◽  
Composite Solder ◽  
Wetting Angle ◽  
Solder Paste ◽  
Cu Nanoparticles ◽  
Cu Substrate ◽  
Wetting Ability ◽  
Microstructure Morphology

The present work is focused on the preparation and the properties of Sn-Ag-nanoCu composite solder by two methods, i.e. ball milling and paste mixing. Copper nanoparticles were added at two different compositions, 0.7% and 3%, to Sn-3.5Ag solder powder and paste by ball milling and paste mixing, respectively. The composite solder was deposited on the Cu substrate and heated at 250°C for 60 seconds and allowed to cool at room temperature. The wetting ability was evaluated with the wetting angle of deposited composite solder on Cu substrate. The microstructure, morphology and hardness were examined for composite solder joints. It was found that the lowest melting point was achieved at 213.6°C for Sn-3.5Ag-3nanoCu produced by ball milling. The wetting angle deterioted as Cu nanoparticles were added into the Sn-3.5Ag solder paste by paste mixing. However, when Cu nanoparticles were added by 0.7% and 3.0% by ball milling, the wetting angle improved by 5% and 37%, respectively. The hardness of composite solder improved up to 32% when 3% Cu was added by ball milling.

Improvement of Sn-0.7Cu Lead Free Solder Joints on Shear Strength with Addition of Titanium Oxide (TiO2) Particles

2016 ◽  
Vol 857 ◽  
pp. 68-72
Author(s):  
Norhayanti Mohd Nasir ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Titanium Oxide ◽  
Composite Solder ◽  
Microwave Sintering ◽  
Lead Free ◽  
Lead Free Solder ◽  
Composite Solder Joint ◽  
Weight Percentage ◽  
Free Solder

In this paper, Sn-0.7Cu composite containing weight percentage of 1.0 wt. % of titanium oxide (TiO2) particles were successfully fabricated by using the powder metallurgy (PM) route assisted hybrid microwave sintering. This research investigated the effect s of TiO2 particles addition on the interfacial reactions formed between Sn-0.7Cu solder/substrate and shear strength of a Sn-0.7Cu solder alloy. With the increasing of TiO2 particles, Sn-0.7Cu-TiO2 composite solder showed decreasing in thickness value and shear strength was increased. This signified that the presence of TiO2 particles effect on the thickness of Cu6Sn5 IMC layer at the interface and mechanical properties Sn-0.7Cu composite solder joint.

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