Investigation of Slow Eutectoid Element on Tensile Properties and Superplasticity of a Forged SP700 Titanium Alloy

The tensile properties and superplasticity of a forged SP700 alloy with slow eutectoid element (1.5%Cr) addition were investigated in the present paper. The results of the microstructures showed that slow eutectoid element Cr has a significant influence on stabilizing the β phase and the SP700Cr alloy showed a uniform duplex and completely globular microstructure after annealing at 820 °C for 1 h and aging at 500 °C for 6 h. The results of the tensile tests showed that the yield strength, ultimate tensile strength and elongation of the alloy with optimized microstructure were 1312 MPa, 1211 MPa and 10% at room temperature, and the elongation was achieved to 1127% at 770 °C. Compared with that of the SP700 alloy, the strain rate sensitivity of the SP700Cr alloy showed a higher value. The microstructures after elevated temperature tensile tests showed that the higher density of dislocations and twins exists in SP700 alloy and the lower density of dislocations favor distribution in SP700Cr alloy. Based on the above results, the tensile properties and superplasticity of the forged SP700 alloy with 1.5% Cr addition was analyzed. In addition, microstructure characteristics were investigated by the TEM and EBSD technologies.

Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

The nucleation kinetics and morphology of Cu6Sn5 IMCs at the interface between a Sn-0.7Cu-0.2Cr solder and Cu substrate were investigated in this study. A Sn-0.7Cu solder was utilized as a reference to elucidate the impact of Cr addition. The mechanical properties of the solder joints were determined via ball-shear tests. Cu coupons were dipped in the molten solders for 1 and 3 s at 240–300 °C, and the morphological analyses were conducted via electron microscopy. Both the solders contained scallop-like Cu6Sn5 IMCs. The smallest Cu6Sn5 IMCs were observed at 260 °C in both the solders, and the particle size increased at 280 and 300 °C. The IMCs in the Sn-0.7Cu-0.2Cr solder were smaller and thinner than those in the Sn-0.7Cu solder at all the reaction temperatures. The thickness of the IMCs increased as the reaction temperature increased. Inverse C-type nucleation curves were obtained, and the maximum nucleation rate was observed at an intermediate temperature. The shear strengths of the Sn-0.7Cu-0.2Cr solder joints were higher than those of the Sn-0.7Cu solder joints. This study will facilitate the application of lead-free solders, such as Sn-0.7Cu-0.2Cr, in automotive electrical components.