Study of Crack Dynamics Using the Virtual Internal Bond Method

Author(s):  
Patrick A. Klein ◽  
Huajian Gao
2017 ◽  
Vol 14 (06) ◽  
pp. 1750066 ◽  
Author(s):  
Yaxiong Chen ◽  
Zhennan Zhang

The discretized virtual internal bond (DVIB) is a newly developed lattice bond method for fracture simulation. The discrete structure of the DVIB method is composed of unit bond cells, which can take any geometry with any number of bonds. Hence, the DVIB is able to represent the meso-structural characters of a material composed of micro-grains. The regular hexagon is fully symmetrical in geometry, isotropic with respect to fracture propagation and has more failure directions than the usual triangular cell. Due to its geometric advantages, the regular hexagon is adopted as the unit cell of DVIB to simulate the dynamic fracture propagation. It is shown that the fracture paths simulated by this method are independent of the mesh scheme and the simulation results are reliable. The interaction between particles is characterized by a hyperelastic bond potential, and most characters of the dynamic fracture behaviors are captured. It is suggested that the DVIB with regular hexagon cells is a reliable and efficient method for dynamic fracture simulation.


Polymers ◽  
2021 ◽  
Vol 13 (3) ◽  
pp. 319
Author(s):  
Marius Cătălin Barbu ◽  
Zeno Montecuccoli ◽  
Jakob Förg ◽  
Ulrike Barbeck ◽  
Petr Klímek ◽  
...  

Brewer’s spent grain (BSG) is the richest by-product (85%) of the beer-brewing industry, that can be upcycled in a plentiful of applications, from animal feed, bioethanol production or for removal of heavy metals from wastewater. The aim of this research is to investigate the mechanical, physical and structural properties of particleboard manufactured with a mixture of wood particles and BSG gradually added/replacement in 10%, 30% and 50%, glued with polymeric diisocyanate (pMDI), urea-formaldehyde (UF) and melamine urea-formaldehyde (MUF) adhesives. The density, internal bond, modulus of rupture, modulus of elasticity, screw withdrawal resistance, thickness swelling and water absorption were tested. Furthermore, scanning electron microscopy anaylsis was carried out to analyze the structure of the panels after the internal bond test. Overall, it was shown that the adding of BSG decreases the mechanical performance of particleboard, due to reduction of the bonding between wood and BSG particles. This decrease has been associated with the structural differences proven by SEM inspection. Interaction of particles with the adhesive is different for boards containing BSG compared to those made from wood. Nevertheless, decrease in the mechanical properties was not critical for particleboards produced with 10% BSG which could be potentially classified as a P2 type, this means application in non-load-bearing panel for interior use in dry conditions, with high dimensional stability and stiffness.


2009 ◽  
Vol 76 (9) ◽  
pp. 1231-1246 ◽  
Author(s):  
Svetlana Vasić ◽  
Ario Ceccotti ◽  
Ian Smith ◽  
Jakub Sandak
Keyword(s):  

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