Moire Interferometry Studies of Displacement Fields Surrounding Elastic Plastic Bimetallic Interface Cracks

1988 ◽  
pp. 234-239
Author(s):  
J. S. Epstein
Keyword(s):  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Displacement Fields ◽  
Interface Cracks ◽  
Elastic Plastic ◽  
Bimetallic Interface

scholarly journals Displacement fields (U,W) obtained simultaneously by moiré interferometry

1982 ◽  
Vol 21 (14) ◽  
pp. 2558 ◽  
Author(s):  
Michael L. Basehore ◽  
Daniel Post
Keyword(s):  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Displacement Fields

scholarly journals Measurements of the Near-Tip Deformation in Inhomogeneous Elastic-Plastic Fracture Specimens Using the Moire Interferometry.

1993 ◽  
Vol 59 (559) ◽  
pp. 558-565
Author(s):  
Toshihisa Nishioka ◽  
Masaki Nishi ◽  
Takehiro Fujimoto ◽  
Keigo Sakakura ◽  
Jonathan Epstein S.
Keyword(s):  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Elastic Plastic ◽  
Fracture Specimens

Measuring displacement fields of curved surface by moire interferometry of partial coherent light

1993 ◽  
Vol 9 (2) ◽  
pp. 177-184 ◽  
Author(s):  
Zhong Guocheng ◽  
Wang Bing ◽  
Jiang Xiaolin ◽  
Dai Fulong
Keyword(s):  
Moiré Interferometry ◽  
Curved Surface ◽  
Moire Interferometry ◽  
Coherent Light ◽  
Displacement Fields

Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry

1990 ◽  
Vol 112 (4) ◽  
pp. 303-308 ◽  
Author(s):  
A. F. Bastawros ◽  
A. S. Voloshin
Keyword(s):  
Mechanical Strain ◽  
Thermal Strain ◽  
Strain Analysis ◽  
Moiré Interferometry ◽  
Experimental Methodology ◽  
Moire Interferometry ◽  
Displacement Fields ◽  
Thermally Induced ◽  
Contour Maps ◽  
Strain Components

Fractional Fringe Moire´ Interferometry (FFMI)—a new experimental methodology to measure accurately deformations and consequently strains—has been successfully implemented to determine thermally induced strains in a specimen made from an AT&T 1MB DRAM device. The specimen was heated uniformly from room temperature to 90° C. Resulting moire´ fringe patterns were recorded, analyzed using digital-image-processing and in plane displacements in the device were determined. Strain components were computed by simple differentiation of the displacement fields. The technique proved to be successful in detecting full displacement fields with submicron resolution. Contour maps showing actual thermo/mechanical strain components in the specimen were constructed. Those maps can provide an excellent tool realistic for strain analysis of microelectronic devices regardless of the structural and material complexity.

Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

1996 ◽  
Vol 118 (3) ◽  
pp. 157-163 ◽  
Author(s):  
B. Han ◽  
Y. Guo ◽  
C. K. Lim ◽  
D. Caletka
Keyword(s):  
Numerical Models ◽  
Measurement Methods ◽  
Moiré Interferometry ◽  
Displacement Measurement ◽  
Optical Methods ◽  
Moire Interferometry ◽  
Displacement Fields ◽  
Microelectronics Packaging ◽  
Packaging Design ◽  
Plane Displacement

Verified/predictive modeling has become an integral part of electronic packaging product development in order to reduce costs and cycle time. In this paper, interferometric displacement measurement methods are utilized to verify the validity of numerical models for microelectronics packaging design. Three optical methods with submicron sensitivities are employed: moire´ interferometry, microscopic moire´ interferometry and Twyman/Green interferometry. The first two provide contour maps of in-plane displacement fields, and the third maps out-of-plane displacement fields. Their high sensitivity and high spatial resolution make them ideally suited for verification of numerical models. By combining numerical modeling and experimental verification until the results merge, numerical models become more accurate and dependable. Then, the models can be applied extensively to optimize the package designs with confidence that the models provide effective information on material and geometry sensitivity.

scholarly journals Bayesian Identification of Elastic Constants in Multi-Directional Laminate from Moiré Interferometry Displacement Fields

2012 ◽  
Vol 53 (4) ◽  
pp. 635-648 ◽  
Author(s):  
C. Gogu ◽  
W. Yin ◽  
R. Haftka ◽  
P. Ifju ◽  
J. Molimard ◽  
...  
Keyword(s):  
Elastic Constants ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Displacement Fields ◽  
Bayesian Identification
Sign in / Sign up

Export Citation Format

Share Document