High Complexity Smart Power Devices and Future Developments

2002 ◽  
pp. 435-463
Author(s):  
G. Pedrazzini ◽  
S. Storti
Keyword(s):  
High Complexity ◽  
Power Devices ◽  
Smart Power ◽  
Future Developments

Smart Power Devices and ICs Using GaAs and Wide and Extreme Bandgap Semiconductors

2017 ◽  
Vol 64 (3) ◽  
pp. 856-873 ◽  
Author(s):  
T. Paul Chow ◽  
Ichiro Omura ◽  
Masataka Higashiwaki ◽  
Hiroshi Kawarada ◽  
Vipindas Pala
Keyword(s):  
Power Devices ◽  
Smart Power ◽  
Bandgap Semiconductors

Physical models for smart-power devices

2006 ◽  
Author(s):  
M. Rudan ◽  
S. Reggiani ◽  
E. Gnani ◽  
G. Baccarani ◽  
C. corvasce ◽  
...  
Keyword(s):  
Physical Models ◽  
Power Devices ◽  
Smart Power

Electro-Thermal Design of Smart Power Devices and Integrated Circuits

2014 ◽  
Vol 918 ◽  
pp. 191-194 ◽  
Author(s):  
Konstantin O. Petrosyants ◽  
Igor A. Kharitonov ◽  
Nikita I. Ryabov
Keyword(s):  
Integrated Circuits ◽  
High Power ◽  
Temperature Sensors ◽  
Thermal Design ◽  
Analysis Tool ◽  
Power Devices ◽  
Smart Power ◽  
Power Semiconductor ◽  
Power Semiconductor Devices ◽  
Combined Use

An efficient methodology of electro-thermal design of smart power semiconductor devices and ICs, based on the combined use of SPICE circuit analysis tool and software tools for 2D/3D thermal simulation of IC chip construction, is presented. The features of low, medium and high power elements, temperature sensors, IC chips simulation are considered.

Reliability study of thermal cycling stress on smart power devices

2014 ◽  
Vol 53 (4S) ◽  
pp. 04EP12 ◽  
Author(s):  
Ming Zhang ◽  
Yasuki Yoshihisa ◽  
Keiichi Furuya ◽  
Yukari Imai ◽  
Kenichi Hatasako ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Power Devices ◽  
Reliability Study ◽  
Smart Power
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