The Cooling of Electronic Components with Flat Plate Heat Sinks

1994 ◽  
pp. 391-414 ◽  
Author(s):  
Robert J. Krane ◽  
Iqballudin Ahmed ◽  
J. Roger Parsons
2014 ◽  
Vol 960-961 ◽  
pp. 389-393
Author(s):  
Ya Ping Zhang ◽  
J.G. Wang

A trend towards increasingly dense and compact architectures has led to unmanageably high heat fluxes in electronic components. A novel heat pipe will be developed. Heat pipe designed is based on the flat plate heat pipe and pulsation heat pipe effective combination. Channel quantity is greatly increased ,as well as compact and homogeneous red copper pulsation plank is severed as the wick,dense and connected channels are served as the passage of the working fluid.


Solar Energy ◽  
2019 ◽  
Vol 181 ◽  
pp. 361-371 ◽  
Author(s):  
Alvaro Valera ◽  
Eduardo F. Fernández ◽  
Pedro M. Rodrigo ◽  
Florencia Almonacid
Keyword(s):  

2022 ◽  
Vol 26 (1) ◽  
pp. 1-14
Author(s):  
Dalmn Y. Taha ◽  
◽  
Dhamyaa S. Khudhur ◽  
Layla M. Nassir ◽  
◽  
...  

In this paper, a statistical analysis was applied to the numerical predictions of temperature distribution for the heat sinks. There are two types of heat sink with an array of impingement. The first type is a flat plate heat sink, and the second type is arcs-fins heat sinks. The second type category considers five models (A, B, C, D, and E). The shapes of fins were changed, but the thickness, distance between fins, and radius were held fixed for comparing and analyzing them depending upon the improvement of the fin geometry of heat sink. The heat sinks of the two types are subjected to multi impinging flow at different Reynolds numbers (7000-11000). Thermodynamic and hydraulic results were collected. The best model was calculated through a statistical analysis. The efficiency of an arcs-fin heat sink was superior to that of the flat plate heat sink. The findings of Model D were more appropriate than those of the other models. The concave arc near the heat sink's exit (model D) created better effect than the convex arc (model E), despite the fact that the (model D) shape fins being identical to (model E) shape fins (only rotated 180° at the same location). However, Descriptive Statistics manifested that in all situations, the mean temperature for (model D) is better than (model E). The results of comparison between the flat plate heat sink and models (D and E) evinced that the average heat sink temperature in the suggested design reduced via 12%, 8%, while the (model E) decreased by 12%, 7% for Re (7000, 9000), respectively. In addition, the two models maintained the same percentage of (8% and 7%) improvement at Re (11000). The correlation coefficient between the flat plate and the arcs-fins heat sink for model B has the highest value (0.809), while model A has the lowest value of correlation (0.673).


1994 ◽  
Vol 116 (1) ◽  
pp. 60-67 ◽  
Author(s):  
I. Ahmed ◽  
R. J. Krane ◽  
J. R. Parsons

Flat rectangular plate heat sinks are often used to cool large electronic components by the combined effects of natural convection and thermal radiation. There is, however, a paucity of rational design techniques for these devices. Thus, a systematic program to investigate the use of flat, rectangular plate heat sinks with surface coatings to enhance the net radiative exchange with the surroundings has been undertaken. The preliminary results of this program are presented in this work. A two-dimensional numerical model of a single electronic component mounted on a vertically oriented, flat rectangular plate heat sink that is located immediately above an upward-facing, horizontal component board was developed for this investigation. This model, which is solved using a control volume method based on the SIMPLER algorithm, accounts for the fully-coupled natural convection, conduction and radiative heat transfer processes that occur in the two-dimensional heat sink configuration described above. The results of a parametric study performed with the numerical model confirm the necessity of employing a heat sink, since for the ranges of values investigated, from 64 to 88 percent of the energy dissipated in the component is transferred to the surroundings from the heat sink. The parametric study examines the effects of component power, heat sink size (height), the thickness and emissivity of the heat sink, the vertical location of the component on the heat sink, and the temperature of the horizontal component board on the temperature of the component mounted on the heat sink.


Author(s):  
D. R. Veeresha ◽  
Ch. SimhachalaRao ◽  
M. K. Shailandran ◽  
S. G. Barve ◽  
D. Kumar ◽  
...  

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