Cellular junctions on the free surface of human placental syncytium

1987 ◽  
Vol 240 (4) ◽  
pp. 211-216 ◽  
Author(s):  
T. Wang ◽  
J. Schneider
Keyword(s):  
Free Surface ◽  
Cellular Junctions

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

Study of Bubble Bursting at Free Surface using Coupled Eulerian-Lagrangian Approach

2018 ◽  
Author(s):  
Digvijay Singh ◽  
Arup Kumar Das
Keyword(s):  
Free Surface ◽  
Lagrangian Approach ◽  
Bubble Bursting

Influence of Local Flow Acceleration on the Heat Transfer of Submerged and Free-surface Jet Impingement

2014 ◽  
Author(s):  
Wilko Rohlfs ◽  
Claas Ehrenpreis ◽  
Herman D. Haustein ◽  
Oliver Garbrecht ◽  
Reinhold Kneer
Keyword(s):  
Heat Transfer ◽  
Free Surface ◽  
Jet Impingement ◽  
Local Flow ◽  
Flow Acceleration ◽  
Surface Jet
Sign in / Sign up

Export Citation Format

Share Document