Determination of thermal strains by moiré interferometry

1989 ◽  
Vol 29 (3) ◽  
pp. 318-322 ◽  
Author(s):  
D. Post ◽  
J. D. Wood
Keyword(s):  
Moiré Interferometry ◽  
Moire Interferometry

Determination of residual stresses within plasma spray coating using Moiré interferometry method

2011 ◽  
Vol 257 (6) ◽  
pp. 2332-2336 ◽  
Author(s):  
Jiang Yi ◽  
Xu Bin-shi ◽  
Wang Hai-dou ◽  
Liu Ming ◽  
Lu Yao-hui
Keyword(s):  
Residual Stresses ◽  
Plasma Spray ◽  
Spray Coating ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Plasma Spray Coating ◽  
Interferometry Method

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

1995 ◽  
Vol 117 (3) ◽  
pp. 185-191 ◽  
Author(s):  
B. Han ◽  
Y. Guo
Keyword(s):  
Mechanical Behavior ◽  
Electronic Packaging ◽  
Early Stage ◽  
High Sensitivity ◽  
Moiré Interferometry ◽  
Deformation Analysis ◽  
Moire Interferometry ◽  
Plated Through Hole ◽  
Chip Carrier

Thermo-mechanical behavior of various levels of electronic packaging products is studied by moire´ and microscopic moire´ interferometry. The global deformations of packages with complex geometries and the local deformations of solder interconnections are determined by displacement measurements of high sensitivity and high spatial resolution. Several packaging studies are reviewed. They include analyses of thin small outline package, leadless chip carrier package, surface mount array package, chip/organic carrier package, deformation near a plated through hole, and determination of an effective CTE. In-situ and quantitative nature of the methods leads to more accurate and realistic understanding of the macro and micro mechanical behavior of packaging assemblies and interconnections, which in turn, facilitates design evaluation and optimization at an early stage of product development.

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