scholarly journals Mathematical methods for physical layout of printed circuit boards: an overview

OR Spectrum ◽  
2007 ◽  
Vol 30 (3) ◽  
pp. 453-468 ◽  
Author(s):  
Nadine Abboud ◽  
Martin Grötschel ◽  
Thorsten Koch
Author(s):  
A.A. Nester

Purpose. The modern state with the booty of copper ores andproduction of copper are considered in Ukraine.The task of the article is to carry out a forecast of soil contamination with slurries of printed circuit boards and electroplating. This allows to improve the ecological safety of territories of enterprises producing boards and electroplating. The methodology. The article uses mathematical methods of calculation according to the theory of porous media physicochemical hydrodynamics. This process is described by the equation of movement and conservation of mass of matter in vertical shifts. Findings. The main result of the given work is to improve the method for determining consequences of soil contamination by sludge from PCB and electroplating producing shops. The originality. To avoid the accumulation of sludge in the territory of enterprises we propose to use the technology of spent etching solution regeneration where the selected metal is used as secondary raw materials for copper production and recovered solution is reused for etching printed circuit boards. This way almost no sludge is generated, or their quantity is negligible. Practical implications. The article helps to understand the harmfulness of sludge storage in the enterprise and shows the working method to develop recycling technologies and reuse etching solution during etching PCB.


2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.


2014 ◽  
Vol 13 (10) ◽  
pp. 2601-2607 ◽  
Author(s):  
Jae-chun Lee ◽  
Manoj Kumar ◽  
Min-Seuk Kim ◽  
Jinki Jeong ◽  
Kyoungkeun Yoo

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