Optimizing acid leaching of copper from the wastewater treatment sludge of a printed circuit board industry using factorial experimental design

2019 ◽  
Vol 21 (6) ◽  
pp. 1291-1299 ◽  
Author(s):  
Usarat Thawornchaisit ◽  
Kamalasiri Juthaisong ◽  
Kasama Parsongjeen ◽  
Phonsiri Phoengchan
2018 ◽  
Vol 2018 ◽  
pp. 1-10 ◽  
Author(s):  
P. Sivakumar ◽  
D. Prabhakaran ◽  
M. Thirumarimurugan

The aim of the study was to recover copper and lead metal from waste printed circuit boards (PCBs). The electrowinning method is found to be an effective recycling process to recover copper and lead metal from printed circuit board wastes. In order to simplify the process with affordable equipment, a simple ammonical leaching operation method was adopted. The selected PCBs were incinerated into fine ash powder at 500°C for 1 hour in the pyrolysis reactor. Then, the fine ash powder was subjected to acid-leaching process to recover the metals with varying conditions like acid-base concentration, electrode combination, and leaching time. The relative electrolysis solution of 0.1 M lead nitrate for lead and 0.1 M copper sulphate for copper was used to extract metals from PCBs at room temperature. The amount of lead and copper extracted from the process was determined by an atomic absorption spectrophotometer, and results found were 73.29% and 82.17%, respectively. Further, the optimum conditions for the recovery of metals were determined by using RSM software. The results showed that the percentage of lead and copper recovery were 78.25% and 89.1% should be 4 hrs 10 A/dm2.


2014 ◽  
Vol 874 ◽  
pp. 139-143 ◽  
Author(s):  
Jacek Pietraszek ◽  
Aneta Gądek-Moszczak ◽  
Tomasz Toruński

PartnerTech provides printed circuit board (PCB) assembly on request. Wired elements are assembled in through-hole technology and soldered on the wave soldering machine. The PCB with inserted elements is passed across the pumped wave of melted solder. Typically this process is accompanied by some class of defects like cracks, cavities, wrong solder thickness and poor conductor. In PartnerTech Ltd. another type of defects was observed: dispersion of small droplets of solder around holes. Quality assurance department plans to optimize the process in order to reduce the number of defects. In the first stage, it was necessary to develop a methodology for counting defects. This paper presents experimental design and analysis related to this project.


JOM ◽  
1989 ◽  
Vol 41 (4) ◽  
pp. 25-27
Author(s):  
Joseph A. Castrovilla

1987 ◽  
Vol 108 ◽  
Author(s):  
David Wei Wang

The printed circuit board is an integral part of the electronic packaging hierarchy. Its use began more than 40 years ago, and the demand for printed circuit boards has increased in parallel with the growth of the electronics industry.[1] According to a recent forecast, the worldwide production of printed circuit boards will reach to over 19 billion U.S. dollars' worth by 1990.[2] With continuing demands for more interconnections, the multilayer circuit board industry is experiencing its fastest growth rate. Boards with more than 20 inner planes of circuitry are being manufactured with high reliability.Based on dollar values, more than 90% of the circuit boards produced are in the rigid board category, where starting materials are based on thermosetting prepregs produced by a solution impregnation method. This article is a review of materials currently used in rigid composites.


Sign in / Sign up

Export Citation Format

Share Document