Modeling of Errors Counting System for PCB Soldered in the Wave Soldering Technology

2014 ◽  
Vol 874 ◽  
pp. 139-143 ◽  
Author(s):  
Jacek Pietraszek ◽  
Aneta Gądek-Moszczak ◽  
Tomasz Toruński
Keyword(s):  
Quality Assurance ◽  
Experimental Design ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Counting System ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Wave Soldering ◽  
Soldering Technology ◽  
Through Hole

PartnerTech provides printed circuit board (PCB) assembly on request. Wired elements are assembled in through-hole technology and soldered on the wave soldering machine. The PCB with inserted elements is passed across the pumped wave of melted solder. Typically this process is accompanied by some class of defects like cracks, cavities, wrong solder thickness and poor conductor. In PartnerTech Ltd. another type of defects was observed: dispersion of small droplets of solder around holes. Quality assurance department plans to optimize the process in order to reduce the number of defects. In the first stage, it was necessary to develop a methodology for counting defects. This paper presents experimental design and analysis related to this project.

Thermal Model of Printed Circuit Board Plated-Through Hole under One-Sided Heating Conditions

2021 ◽  
Vol 26 (5) ◽  
pp. 426-431
Author(s):  
V.A. Sergeev ◽  
◽  
A.M. Khodakov ◽  
M.Yu. Salnikov ◽  
◽  
...  
Keyword(s):  
Quality Control ◽  
Thermal Resistance ◽  
Thermal Model ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Thermal Models ◽  
Printed Circuit ◽  
Plated Through Hole ◽  
Through Hole

Thermal methods of quality control of the plated-through hole (PTH) of printed circuit board (PCB) are based on thermal models. However, known thermal models of PTH take no account of heat transfer to PCB material thus not allowing for PTH heat characteristic tying up with adhesion quality. In this work, an axisymmetric thermal model of a single-layer PCB PTH under one-sided heating conditions is considered. It was shown that the ratio of the temperature increments of the upper (heated) and lower end of the PTH in the considered range of heating power does not depend on the power level. A linear thermal equivalent scheme of the PTH has been proposed, which includes the longitudinal thermal resistance of the PTH metallization, de-termined by the parameters and quality of the metallization layer, the thermal resistance, which determines the convection heat exchange between the ends of the PTH with the adjacent PCB surface and the environment, and the thermal resistance of the area of the PCB material adjacent to the PTH, depending on the quality of the metallization adhesion and the PCB dielectric. Thermal equivalent circuit parameters determined by the ratio of the temperature increment of the upper and lower ends of the PTH and their difference can serve as the basis for the development of a nondestructive inspection procedure for PTH quality control by way of its unilateral heating, for example, by a laser beam.

A Virtual Prototyping Framework for Electronics Manufacturing

Manufacturing ◽  
2002 ◽  
Author(s):  
J. Cecil ◽  
A. Kanchanapiboon
Keyword(s):  
Life Cycle ◽  
Printed Circuit Board ◽  
Virtual Prototyping ◽  
Circuit Board ◽  
Electronics Manufacturing ◽  
Functional Evaluation ◽  
Surface Mount Technology ◽  
Team Members ◽  
Printed Circuit ◽  
Pcb Assembly

This paper presents a framework for supporting virtual prototyping related activities in the domain of printed circuit board (PCB) assembly. The focus of discussion is restricted to Surface Mount Technology (SMT) based processes only. In general, Virtual Prototyping enables the conceptualization, evaluation and validation of proposed ideas, plans and solutions. Using a virtual prototyping framework, cross functional evaluation and analysis can be facilitated where designers, manufacturing engineers, testing and other life-cycle team members can communicate effectively as well as identify and eliminate problems, which may arise later in the downstream manufacturing and testing activities.

Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: Case Study

2005 ◽  
Author(s):  
Frank Toth ◽  
Gary F. Shade
Keyword(s):  
Printed Circuit Board ◽  
Failure Modes ◽  
Circuit Board ◽  
Lead Free ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
New Process ◽  
Solder Pastes

Abstract Printed Circuit Board (PCB) assemblies are moving toward lead-free (LF) alloys and away from the traditional Sn-Pb alloy [1]. This change is creating new and unique failure modes as the process adapts to accommodate the higher temperatures of the new process [2]. In addition, mis-processed lots are more likely due to the complexity of assembling a mix of Sn-Pb and leadfree solders, components, PCBs, solder pastes, and fluxes. This case study helps to highlight the challenge and provides an example of what can happen, how to detect it, and how the defects can cause reliability failures.

A Simplified Branch-and-Price Mechanism for a Three-Machine Dynamic PCB Assembly

2014 ◽  
Vol 598 ◽  
pp. 398-403 ◽  
Author(s):  
M.T. Yazdani Sabouni ◽  
Rasaratnam Logendran
Keyword(s):  
Printed Circuit Board ◽  
Setup Time ◽  
Circuit Board ◽  
Price Mechanism ◽  
Branch And Price ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Complete Form ◽  
Optimal Approach ◽  
Machine Problem

A dynamic Printed Circuit Board (PCB) assembly system along with the most complete form of setup time in this assembly is introduced in this paper. An effective Branch-and-Price mechanism is employed to develop a lower bound for the three-machine problem. However, solving the sub problems remains computationally difficult because of their NP-hard nature. An optimal approach is established, which makes solving the sub problems computationally feasible.

The Design Principle and Application of Power Resistor with over Temperature and over Current Protection Function

2012 ◽  
Vol 562-564 ◽  
pp. 1501-1504 ◽  
Author(s):  
Sa Zhang ◽  
Zhong Hou Xu ◽  
Shi Chen ◽  
You Sheng Xu ◽  
Gen Hua Wu
Keyword(s):  
Design Principle ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Compact Structure ◽  
Printed Circuit ◽  
Size And Shape ◽  
Wave Soldering ◽  
Technological Improvement

A power resistor with over temperature and over current protection function was designed in this paper, we developed a compact structure innovatively which integrated thermal cutoff and wire wound resistor in a tubular case. It has the same size and shape as a resistor without Printed Circuit Board redesign, offer higher security and wave-soldering. It is really a very important technological improvement and breakthrough in over-heat protective field of wire wound resistor .

Modeling of Order Oriented Planning for Printed Circuit Board Assembly Line

2015 ◽  
Vol 789-790 ◽  
pp. 1245-1251
Author(s):  
Ullah Saif ◽  
Zai Lin Guan ◽  
Zong Dong He ◽  
Cong He ◽  
Cao Jun
Keyword(s):  
Assembly Line ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Mixed Integer ◽  
Assembly Planning ◽  
Sequencing Problem ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Planning Problems ◽  
Model Sequencing

Printed circuit board (PCB) assembly planning problem has been given lot of attention to efficiently manage the orders of different PCB products. However, little effort has been paid to describe its comprehensive model which can demonstrate all the planning problems collectively considering in the surface mount technology (SMT) lines. A mixed integer model for PCB assembly line which includes the integration of different levels of the planning problems and considered component allocation problem (line balancing), PCB model sequencing problem (mixed model sequencing problem), feeder arrangement problem and component placement sequencing problem on different SMT machines collectively. Current research is significant to solve different planning problems of the PCB assembly line simultaneously to get the overall global solution of the problem in future.

Optimizing the Performance of Chip Shooter Machine Based on Ant Colony Algorithm

2012 ◽  
Vol 224 ◽  
pp. 47-50
Author(s):  
Xuan Du ◽  
Gang Yu
Keyword(s):  
Optimization Problem ◽  
Ant Colony Algorithm ◽  
Printed Circuit Board ◽  
Ant Colony ◽  
Circuit Board ◽  
Component Placement ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Communication Function ◽  
Feeder Arrangement

The component placement sequence and feeder arrangement are two critical factors determining the assembly time of chip-shooter machine (CS). In addition, the different size of component and different arrangement strategy affect the feeder arrangement and component placement sequence. Based on the engineering analysis, an integrated optimization model of printed circuit board (PCB) assembly for CS machine is established. According to the parallel placement character of CS machine, "Max-Min Ant Colony Algorithm with Communication function (MMAC)" is designed based on traditional Ant Colony Algorithm. The idea that two ants with different duties collaborate to solve the optimization problem is presented. Guide ants optimize placement sequence while executant ants optimize feeder arrangement according to the components placement sequence. The component placement sequence and feeder arrangement are optimized simultaneously

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