Characterization of Material Properties of 2xxx Series Al-Alloys by Non Destructive Testing Techniques

2011 ◽  
Vol 31 (1) ◽  
pp. 17-33 ◽  
Author(s):  
Fawad Tariq ◽  
Nausheen Naz ◽  
Rasheed Ahmed Baloch ◽  
Faisal
Keyword(s):  
Material Properties ◽  
Al Alloys ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Testing Techniques ◽  
Non Destructive

scholarly journals Characterization of Ancient Marquetry Using Different Non-Destructive Testing Techniques

2021 ◽  
Vol 11 (17) ◽  
pp. 7979
Author(s):  
Henrique Fernandes ◽  
Jannik Summa ◽  
Julie Daudre ◽  
Ute Rabe ◽  
Jonas Fell ◽  
...  
Keyword(s):  
Cultural Heritage ◽  
Infrared Thermography ◽  
The Other ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
X Ray ◽  
Testing Techniques ◽  
Micro Tomography ◽  
Non Destructive

Non-destructive testing of objects and structures is a valuable tool, especially in cultural heritage where the preservation of the inspected sample is of vital importance. In this paper, a decorative marquetry sample is inspected with three non-destructive testing (NDT) techniques: air-coupled ultrasound, X-ray micro-tomography, and infrared thermography. Results from the three techniques were compared and discussed. X-ray micro-tomography presented the most detailed results. On the other hand, infrared thermography provided interesting results with the advantage of being cheap and easy in the deployment of the NDT method.

Characterization of Aging Behavior of AA6061 Aluminum Alloy Through Destructive and Ultrasonic Non-destructive Testing Techniques

2014 ◽  
Vol 68 (4) ◽  
pp. 561-569
Author(s):  
Meysam Toozandehjani ◽  
Faizal Mustapha ◽  
Nur Ismarrubie Zahari ◽  
Mohd Khairol Anuar Ariffin ◽  
Khamirul Amin Matori ◽  
...  
Keyword(s):  
Aluminum Alloy ◽  
Non Destructive Testing ◽  
Aging Behavior ◽  
Destructive Testing ◽  
Testing Techniques ◽  
Non Destructive

Acoustic and Photoacoustic Inspection of Through-Silicon Vias in the GHz-Frequency Band

2017 ◽  
Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Ingrid DeWolf ◽  
Ahmad Khaled ◽  
...  
Keyword(s):  
Quality Assessment ◽  
Frequency Band ◽  
Process Development ◽  
Three Dimensional ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Vertical Interconnection ◽  
Testing Techniques ◽  
Silicon Vias ◽  
Non Destructive

Abstract Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.

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