Acoustic and Photoacoustic Inspection of Through-Silicon Vias in the GHz-Frequency Band

2017 ◽  
Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Ingrid DeWolf ◽  
Ahmad Khaled ◽  
...  
Keyword(s):  
Quality Assessment ◽  
Frequency Band ◽  
Process Development ◽  
Three Dimensional ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Vertical Interconnection ◽  
Testing Techniques ◽  
Silicon Vias ◽  
Non Destructive

Abstract Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.

INSPECTION BY ULTRASONIC TOMOGRAPHY (UT) LEADING TREND IN WELDING JOINT MONITORING

2015 ◽  
Vol 77 (17) ◽  
Author(s):  
Noor Amizan Abd. Rahman ◽  
Ruzairi Abdul Rahim ◽  
Nor Muzakkir Nor Ayob ◽  
Jaysuman Pusppanathan ◽  
Fazlul Rahman Mohd Yunus ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Image Resolution ◽  
Ultrasonic Tomography ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Steel Pipes ◽  
Imaging Result ◽  
Welding Steel ◽  
Joint Monitoring ◽  
Non Destructive

Welding work is a connection process between the structure and the materials. This process is used in the construction, maintenance and repair especially mechanical engineering. This study discusses the type of welding used in the industry, mainly involving the pipeline welds. On-demand need to every work process when finishing weld requires quality tests to ensure compliance to the standards required. Monitoring through the display image has long been used in Non-Destructive Testing (NDT). Various methods of monitoring used in NDT focused on Ultrasonic Tomography (UT) as a method used in NDT and as an option for the future. Previous imaging result was in two-dimensional (2D) and then upgraded to a three-dimensional image (3D). Besides, there is potential of 3D imaging beyond the existing limits in terms of size, material thickness, especially for welding steel pipes. Achievement through research of existing pipe size so far outside diameter of 200 mm and a thickness of 5.8 mm should be limited in view of the obstacles to enhanced image resolution is less effective when compared to other tomography methods.

scholarly journals Porosity and Inclusion Detection in CFRP by Infrared Thermography

2012 ◽  
Vol 2012 ◽  
pp. 1-6 ◽  
Author(s):  
C. Toscano ◽  
C. Meola ◽  
M. C. Iorio ◽  
G. M. Carlomagno
Keyword(s):  
Infrared Thermography ◽  
Production Costs ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Evaluation Methodologies ◽  
Slag Inclusions ◽  
Aeronautical Industry ◽  
Testing Techniques ◽  
Lock In ◽  
Non Destructive

The ever wide use of composite materials in the aeronautical industry has evidenced the need for development of ever more effective nondestructive evaluation methodologies in order to reduce rejected parts and to optimize production costs. Infrared thermography has been recently enclosed amongst the standardized non destructive testing techniques, but its usefulness needs still complete assessment since it can be employed in several different arrangements and for many purposes. In this work, the possibility to detect slag inclusions and porosity is analyzed with both lock-in themography and pulse thermography in the transmission mode. To this end, carbon-fiber-peinforced polymers different specimens are specifically fabricated of several different stacking sequences and with embedded slag inclusions and porosity percentages. As main results, both of the techniques are found definitely able to reveal the presence of the defects above mentioned. Moreover, these techniques could be considered complementary in order to better characterize the nature of the detected defects.

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