Effect of Rare Earth Elements on Lead-Free Solder Microstructure Evolution

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373798 ◽

2007 ◽

Author(s):

Min Pei ◽

Jianmin Qu

Keyword(s):

Rare Earth Elements ◽

Microstructure Evolution ◽

Lead Free ◽

Lead Free Solder ◽

Solder Microstructure ◽

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The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

Journal of Electronic Materials ◽

10.1007/s11664-002-0184-6 ◽

2002 ◽

Vol 31 (9) ◽

pp. 921-927 ◽

Author(s):

C. M. L. Wu ◽

D. Q. Yu ◽

C. M. T. Law ◽

L. Wang

Keyword(s):

Rare Earth Elements ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

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Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2004.01.012 ◽

2004 ◽

Vol 376 (1-2) ◽

pp. 170-175 ◽

Author(s):

D.Q Yu ◽

J Zhao ◽

L Wang

Keyword(s):

Rare Earth Elements ◽

Lead Free ◽

Lead Free Solder ◽

Wetting Properties ◽

Microstructure Stability ◽

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Properties of lead-free solder SnAgCu containing minute amounts of rare earth

Journal of Electronic Materials ◽

10.1007/s11664-003-0215-y ◽

2003 ◽

Vol 32 (4) ◽

pp. 235-243 ◽

Author(s):

Zhigang Chen ◽

Yaowu Shi ◽

Zhidong Xia ◽

Yanfu Yan

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

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Microstructure Evolution, Thermal and Mechanical Property of Co Alloyed Sn-0.7Cu Lead-Free Solder

Journal of Electronic Materials ◽

10.1007/s11664-020-07960-y ◽

2020 ◽

Vol 49 (4) ◽

pp. 2660-2668 ◽

Author(s):

Jianglei Fan ◽

Hengtao Zhai ◽

Zhanyun Liu ◽

Xiao Wang ◽

Xiangkui Zhou ◽

...

Keyword(s):

Mechanical Property ◽

Microstructure Evolution ◽

Lead Free ◽

Lead Free Solder ◽

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Effects of microstructure evolution on damage accumulation in lead-free solder joints

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490795 ◽

2010 ◽

Author(s):

Linlin Yang ◽

Liang Yin ◽

Brian Roggeman ◽

Peter Borgesen

Keyword(s):

Microstructure Evolution ◽

Damage Accumulation ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

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Interface microstructure evolution of lead-free solder on Ni-based under bump metallizations during reflow and high temperature storage

Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA 2004 (IEEE Cat No 04TH8743) IPFA-04 ◽

10.1109/ipfa.2004.1345604 ◽

2004 ◽

Author(s):

Chih Hang Tung ◽

Poi Siong Teo ◽

C. Lee

Keyword(s):

High Temperature ◽

Microstructure Evolution ◽

Lead Free ◽

Lead Free Solder ◽

Interface Microstructure ◽

High Temperature Storage ◽

Free Solder ◽

Temperature Storage

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Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls

Journal of Electronic Materials ◽

10.1007/s11664-008-0454-z ◽

2008 ◽

Vol 37 (7) ◽

pp. 975-981 ◽

Author(s):

Yang Yu ◽

Zhidong Xia ◽

Fu Guo ◽

Yaowu Shi

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Rare Earth Addition ◽

Solder Balls ◽

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Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-020-04196-8 ◽

2020 ◽

Vol 31 (19) ◽

pp. 16437-16447

Author(s):

Xianwei Zeng ◽

Yichi Liu ◽

Jiankang Zhang ◽

Yi Liu ◽

Xiaowu Hu ◽

...

Keyword(s):

Mechanical Properties ◽

High Temperature ◽

Thermal Behavior ◽

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Microstructure And Mechanical Properties ◽

Lead Free Solder Alloy ◽

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Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticles

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-018-0492-0 ◽

2018 ◽

Vol 30 (3) ◽

pp. 2213-2223 ◽

Author(s):

A. F. Abd El-Rehim ◽

H. Y. Zahran ◽

A. M. Yassin

Keyword(s):

Microstructure Evolution ◽

Creep Behavior ◽

Zno Nanoparticles ◽

Lead Free ◽

Tensile Creep ◽

Lead Free Solder ◽

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Effects of dopants on wettability and microstructure evolution of Lead-Free solder joints

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582338 ◽

2010 ◽

Author(s):

Qiang Chen ◽

Guoyuan Li

Keyword(s):

Microstructure Evolution ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

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