Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7 wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm Ni
2012 ◽
Vol 42
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pp. 179-191
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2015 ◽
Vol 106
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pp. 52-61
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2017 ◽
Vol 46
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pp. 1754-1769
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2019 ◽
Vol 752
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pp. 86-92
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2017 ◽
Vol 695
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pp. 228-237
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