Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys

Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7 wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm Ni

Journal of Electronic Materials ◽

10.1007/s11664-012-2263-7 ◽

2012 ◽

Vol 42 (1) ◽

pp. 179-191 ◽

Cited By ~ 29

Author(s):

Bismarck Luiz Silva ◽

Noé Cheung ◽

Amauri Garcia ◽

José Eduardo Spinelli

Keyword(s):

Mechanical Properties ◽

Thermal Parameters ◽

Directionally Solidified ◽

Solder Alloys ◽

Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

Materials Characterization ◽

10.1016/j.matchar.2015.05.015 ◽

2015 ◽

Vol 106 ◽

pp. 52-61 ◽

Cited By ~ 22

Author(s):

Marcelino Dias ◽

Thiago Costa ◽

Otávio Rocha ◽

José E. Spinelli ◽

Noé Cheung ◽

...

Keyword(s):

Mechanical Properties ◽

Thermal Parameters ◽

Lead Free ◽

Lead Free Solder ◽

Directionally Solidified ◽

Solder Alloys ◽

Free Solder

Effect of Bi on microstructure and mechanical properties of Sn-10Sb-1.5Cu (SSC1015) solder alloys

Materials Research Express ◽

10.1088/2053-1591/aaf20d ◽

2018 ◽

Vol 6 (2) ◽

pp. 026565

Author(s):

Xiaoyang Bi ◽

Xiaowu Hu ◽

Yulong Li ◽

Xiongxin Jiang

Keyword(s):

Mechanical Properties ◽

Solder Alloys ◽

Investigation of microstructure and mechanical properties of Sn-xCu solder alloys

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2016.11.371 ◽

2017 ◽

Vol 695 ◽

pp. 3666-3673 ◽

Cited By ~ 21

Author(s):

A.F. Abd El-Rehim ◽

H.Y. Zahran

Keyword(s):

Mechanical Properties ◽

Solder Alloys ◽

Effects of Ni-coated carbon nanotubes addition on the microstructure and mechanical properties of Sn–Ag–Cu solder alloys

Materials Science and Engineering A ◽

10.1016/j.msea.2013.10.008 ◽

2014 ◽

Vol 590 ◽

pp. 295-300 ◽

Cited By ~ 39

Author(s):

Zhongbao Yang ◽

Wei Zhou ◽

Ping Wu

Keyword(s):

Mechanical Properties ◽

Carbon Nanotubes ◽

Solder Alloys ◽

Coated Carbon

Effects of cerium content on wettability, microstructure and mechanical properties of Sn–Ag–Ce solder alloys

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2010.03.179 ◽

2010 ◽

Vol 499 (2) ◽

pp. 154-159 ◽

Cited By ~ 28

Author(s):

Bo-In Noh ◽

Jung-Hyun Choi ◽

Jeong-Won Yoon ◽

Seung-Boo Jung

Keyword(s):

Mechanical Properties ◽

Solder Alloys ◽

Cerium Content ◽

Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2013.03.234 ◽

2013 ◽

Vol 572 ◽

pp. 97-106 ◽

Cited By ~ 117

Author(s):

Wislei R. Osório ◽

Leandro C. Peixoto ◽

Leonardo R. Garcia ◽

Nathalie Mangelinck-Noël ◽

Amauri Garcia

Keyword(s):

Mechanical Properties ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

Free Solder

Effects of Aging on Microstructure and Mechanical Properties of Sn-Ag-Cu-Bi Solder Alloys

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00116 ◽

2021 ◽

Author(s):

Vishnu Shukla ◽

Omar Ahmed ◽

Golareh Jalilvand ◽

Abhishek Mehta ◽

Peng Su ◽

...

Keyword(s):

Mechanical Properties ◽

Solder Alloys ◽

Effects Of Aging

Microstructure and Mechanical Properties of Solder Alloys

Solder Joint Reliability ◽

10.1007/978-1-4615-3910-0_8 ◽

1991 ◽

pp. 266-278 ◽

Cited By ~ 4

Author(s):

Harold J. Frost

Keyword(s):

Mechanical Properties ◽

Solder Alloys ◽

Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints

Microelectronics Reliability ◽

10.1016/j.microrel.2017.08.004 ◽

2017 ◽

Vol 78 ◽

pp. 72-79 ◽

Cited By ~ 4

Author(s):

Qinhan Guo ◽

Zhenjiang Zhao ◽

Chunlong Shen

Keyword(s):

Mechanical Properties ◽

Comparison Study ◽

Solder Alloys ◽