Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry

2014 ◽  
Vol 43 (11) ◽  
pp. 4186-4192 ◽  
Author(s):  
Ting Jiang ◽  
Hong Lei
Keyword(s):  
Chemical Mechanical Polishing ◽  
Cumene Hydroperoxide ◽  
Hard Disk ◽  
Mechanical Polishing ◽  
Hard Disk Substrate ◽  
Disk Substrate

Preparation of Porous Alumina Abrasives with Different Morphologies and their Chemical Mechanical Polishing Behavior

2011 ◽  
Vol 338 ◽  
pp. 415-420 ◽  
Author(s):  
Xin Wu ◽  
Hong Lei ◽  
Ru Ling Chen
Keyword(s):  
Surface Roughness ◽  
Chemical Mechanical Polishing ◽  
Porous Alumina ◽  
Hard Disk ◽  
Mechanical Polishing ◽  
Testing Conditions ◽  
Solid Structure ◽  
Hard Disk Substrate ◽  
Disk Substrate

The traditional solid alumina abrasive has been widely used in commercial slurries. But it is easy to cause polishing scratches due to its dense solid structure. The morphology of the abrasives can also impact on the chemical mechanical polishing (CMP) performances. To improve the CMP performances of the hard disk substrate, rods-like porous alumina and flower-like porous alumina abrasives were prepared and their chemical mechanical polishing behavior investigated. The results showed that the porous alumina abrasives with different morphologies exhibited lower topographical variations and surface roughness than solid alumina abrasives under the same testing conditions.

Chemical mechanical polishing of hard disk substrate with α-alumina-g-polystyrene sulfonic acid composite abrasive

2010 ◽  
Vol 518 (14) ◽  
pp. 3792-3796 ◽  
Author(s):  
Hong Lei ◽  
Naijing Bu ◽  
Ruling Chen ◽  
Ping Hao ◽  
Sima Neng ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Sulfonic Acid ◽  
Hard Disk ◽  
Mechanical Polishing ◽  
Polystyrene Sulfonic Acid ◽  
Hard Disk Substrate ◽  
Disk Substrate

Preparation of Silica-Based Alkaline Slurry and its Application on Chemical Mechanical Polishing of Hard Disk Substrates

2010 ◽  
Vol 44-47 ◽  
pp. 3067-3071
Author(s):  
Sheng Li Wang ◽  
Zhen Xia Li ◽  
Hui Lai Mu ◽  
Yu Tian ◽  
Li Bing Yang
Keyword(s):  
Chemical Mechanical Polishing ◽  
Ph Value ◽  
Removal Rate ◽  
Hard Disk ◽  
Mechanical Polishing ◽  
Experimental Result ◽  
Alkali Concentration ◽  
Oxidant Concentration ◽  
Hard Disk Substrate ◽  
Disk Substrate

Chemical mechanical polishing (CMP) is the effective technology which obtains high accuracy surface of hard disk substrate with nickel-phosphorus (Ni-P) coating. The slurry is significant factor in hard disk substrate CMP. Colloidal silica-based alkaline slurry was prepared based on negative pressure vortex method. The effects of slurry parameters such as abrasive concentration, organic alkali concentration and oxidant concentration on material removal rate and surface characteristics were investigated. The experimental result indicated that the abrasive concentration was 20wt%, the slurry pH value was 11.2, the oxidant concentration was 15ml/L, improved surface roughness and polishing efficiency of hard disk substrates, a smooth surface was obtained and micro scratches could hardly be observed.

Particles detection and analysis of hard disk substrate after cleaning of post chemical mechanical polishing

2009 ◽  
Vol 255 (22) ◽  
pp. 9100-9104 ◽  
Author(s):  
Yating Huang ◽  
Xinchun Lu ◽  
Guoshun Pan ◽  
Bill Lee ◽  
Jianbin Luo
Keyword(s):  
Chemical Mechanical Polishing ◽  
Hard Disk ◽  
Mechanical Polishing ◽  
Hard Disk Substrate ◽  
Disk Substrate

CMP Behavior of α-Alumina-g-Polyvinylpyrrolidone Composite Abrasive on Hard Disk Substrate

2010 ◽  
Vol 97-101 ◽  
pp. 2135-2139 ◽  
Author(s):  
Hong Lei ◽  
Nai Jing Bu ◽  
Feng Ling Chu ◽  
Ping Hao ◽  
Xiao Li Hu
Keyword(s):  
Chemical Mechanical Polishing ◽  
Hard Disk ◽  
Lower Surface ◽  
Surface Grafting ◽  
Grafting Polymerization ◽  
Testing Conditions ◽  
Hard Disk Substrate ◽  
Α Al2o3 ◽  
Polished Substrate ◽  
Disk Substrate

A novel α-alumina-g-polyvinylpyrrolidone (α-Al2O3-g-PVP) composite abrasive was prepared by surface grafting polymerization. The chemical mechanical polishing (CMP) performances of the composite abrasive on hard disk substrate were investigated with a UNIPOL-1502 polishing machine. Analyses on the surface of polished substrate indicated that the α-Al2O3-g-PVP composite abrasive exhibited lower surface roughness, less scratch, and improved post-CMP cleaning performances than pure α-alumina abrasive under the same testing conditions.

Effect of Cu (II) Ion on Abrasive-Free Polishing of Hard Disk Substrate with Peroxyacetic Acid System Slurry

2013 ◽  
Vol 753-755 ◽  
pp. 333-336
Author(s):  
Zhi Jun Wang ◽  
Hong Lei
Keyword(s):  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Removal Rate ◽  
Hard Disk ◽  
Electrochemical Analysis ◽  
Acid System ◽  
Peroxyacetic Acid ◽  
Polishing Process ◽  
Hard Disk Substrate ◽  
Disk Substrate

Recently, abrasive-free polishing (AFP) has attracted a great deal of attention due to its gentler polishing process and lower particle residue than traditional chemical mechanical polishing (CMP). Our present work investigates the effectiveness of Cu (II) ion on AFP of hard disk substrate in peroxyacetic acid (PAA) system slurry. The polishing experimental results show that the PAA/Cu (II) system slurry has higher material removal rate (MRR) and lower roughness (Ra) than PAA system. Further, the reaction mechanism of Cu (II) ion in PAA/Cu (II) system AFP of hard disk substrate was investigated preliminarily by electrochemical analysis.

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