scholarly journals Platelet Composite Coatings for Tin Whisker Mitigation

2015 ◽  
Vol 44 (11) ◽  
pp. 4424-4433 ◽  
Author(s):  
Lauren E. S. Rohwer ◽  
James E. Martin
Keyword(s):  
Composite Coatings ◽  
Tin Whisker ◽  
Tin Whisker Mitigation

Effect of coating adhesion and degradation on tin whisker mitigation of polyurethane-based conformal coatings

2019 ◽  
Vol 166 ◽  
pp. 219-229 ◽  
Author(s):  
Fei Dong ◽  
Stephan J. Meschter ◽  
Shinji Nozaki ◽  
Takeshi Ohshima ◽  
Takahiro Makino ◽  
...  
Keyword(s):  
Tin Whisker ◽  
Coating Adhesion ◽  
Conformal Coatings ◽  
Tin Whisker Mitigation

Tin Whisker mitigation methodologies

2017 ◽  
Vol 95 (4) ◽  
pp. 180-182 ◽  
Author(s):  
Pete Starkey
Keyword(s):  
Tin Whisker ◽  
Tin Whisker Mitigation

Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages

2009 ◽  
Author(s):  
Karl J. L. Geisler
Keyword(s):  
Fatigue Life ◽  
Temperature Cycling ◽  
Tin Whisker ◽  
Conformal Coating ◽  
Failure Data ◽  
Distribution Shape ◽  
Solder Fatigue ◽  
On Chip ◽  
Tin Whisker Mitigation ◽  
The Impact

This study explores the impact of polyurethane conformal coating on the solder fatigue life of 0.5 mm pitch, thin small outline package (TSOP) components. Test samples were subjected to temperature cycling from −40°C to + 100°C. Uncoated samples were tested in addition to sets with 10, 13, and 20 μm thick coatings. Solder joint failure data fit to 3-parameter Weibull distributions demonstrate characteristic fatigue life reductions of 30% with increasing coating thickness but relatively subtle changes to the failure distribution shape.

Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation

2014 ◽  
Vol 561 ◽  
pp. 93-97 ◽  
Author(s):  
Wahyu Diyatmika ◽  
J.P. Chu ◽  
Y.W. Yen ◽  
W.Z. Chang ◽  
C.H. Hsueh
Keyword(s):  
Thin Film ◽  
Metallic Glass ◽  
Room Temperature ◽  
Tin Whisker ◽  
Tin Whisker Mitigation

Long-term thermal aging of parylene conformal coating under high humidity and its effects on tin whisker mitigation

2021 ◽  
pp. 109667
Author(s):  
Preeth Sivakumar ◽  
Surbhi Mahajan Du ◽  
Matt Selter ◽  
Imani Ballard ◽  
John Daye ◽  
...  
Keyword(s):  
Thermal Aging ◽  
High Humidity ◽  
Tin Whisker ◽  
Conformal Coating ◽  
Tin Whisker Mitigation

Ni barrier for tin whisker mitigation

2012 ◽  
Author(s):  
Ting Liu ◽  
Dongyan Ding ◽  
Yiqing Wang ◽  
Yu Hu ◽  
Yihua Gong ◽  
...  
Keyword(s):  
Tin Whisker ◽  
Tin Whisker Mitigation

Assessment of Solder-Dipping as a Tin Whisker Mitigation Strategy

2011 ◽  
Vol 1 (6) ◽  
pp. 957-963 ◽  
Author(s):  
Sony Mathew ◽  
Weiqiang Wang ◽  
Michael Osterman ◽  
Michael Pecht
Keyword(s):  
Mitigation Strategy ◽  
Tin Whisker ◽  
Tin Whisker Mitigation
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