Experimental and numerical investigation of square heat sink having staggered and inline pin fin arrays placed at different orientation

Author(s):  
Pabitra Kumar Mandal ◽  
Sayantan Sengupta ◽  
Subhas Chandra Rana ◽  
Dipankar Bhanja
Author(s):  
Zhuo Cui

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.


2018 ◽  
Vol 99 ◽  
pp. 190-199 ◽  
Author(s):  
Taiho Yeom ◽  
Terrence Simon ◽  
Min Zhang ◽  
Youmin Yu ◽  
Tianhong Cui

2019 ◽  
Vol 48 (5) ◽  
pp. 1857-1888 ◽  
Author(s):  
Umair M. Siddique ◽  
Gulhane P. Nitin ◽  
Sher A. Khan ◽  
Jan Taler ◽  
Arthur Cebula ◽  
...  

1992 ◽  
Vol 12 (1Supplement) ◽  
pp. 239-242
Author(s):  
K. MINAKAMI ◽  
S. MOCHIZUKI ◽  
A. MURATA ◽  
Y. YAGI ◽  
H. IWASAKI

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