Efficient Thermal Energy Management of Hollow Pin Fin Heat Sinks with and without Phase Change Material

Electronic devices need to be cooled efficiently. Phase change material (PCM) could be incorporated into a conventional fin heat sink (FHS) for such a purpose. This paper reports experimental results obtained on the thermal performances of four FHSs fabricated with different arrays and numbers of hollow aluminium pin fins with various lengths and diameters. Tests were conducted with and without filling them with PCM. Heat input was kept on for 2 hours and varied from 1W, 5W and 10W. Transient heating surface temperatures were recorded on a data logger and plotted every 5 minutes. The results showed that the PCM-filled FHS resulted in faster cooling rates and lower heating surface temperatures. Long and large diameter pins performed better than small and short pins. Efficient fin heat sinks for electronic cooling are essential in view of the weight and size of the component. Hence the findings of this paper would be beneficial for electronic cooling and useful to the electronic industry for efficient thermal energy management.

Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications

Two-phase cooling systems based on the thermosyphon operating principle exhibit excellent heat transfer performance, reliability, and flexibility, therefore can be applied to overcome thermal challenges in a wide range of electronic cooling applications and deployment scenarios. However, extremely complex nature of two-phase flow physics involving flow patterns and phase transitions has been the major challenge for technology adoption in industry. This paper demonstrates a machine learning (ML) based model for evaluating the thermal performance and refrigerant mass flow rate, of a thermosyphon cooling system for telecom equipment. Unlike conventional laboratory approach that requires numerous sensors attached to a cooling system to capture their thermal performance, the new model requires a minimum number of sensors to monitor the health of a thermal management solution. Using the proposed model, a system control module can be further developed which could identify optimal operating parameters in real-time under dynamically changing heat load conditions and actively maintain safety and thermal requirements.

Characterization of High-Density Aircraft Electronic and Thermal Management Systems

As aircrafts move toward electrification with the research and development of hybrid-electric powertrains, the focus has begun to shift to the reliability challenges of electronic devices subject to flight. Electronic components in aircraft applications are subject to two main sources of failure inducing stresses: the thermomechanical stresses that develop due to unequal coefficients of thermal expansion of different materials used in the components, and the stresses developing due to shocks and vibrations during flight as well as landing and takeoff. While the challenge of dealing with CTE mismatches is applicable to electronic devices in general, the ambient conditions surrounding the aircraft in flight, combined with weight and space constrains add significant logistical issues to any cooling mechanism. This paper will focus on the environmental influence on the thermal dissipation profile that will ultimately lead to CTE failures. The push toward more-electric-aircraft (MEA) increases the need to further advance the power and versatility of electronic cooling systems to adequately manage high density power modules, which until recently were not highly incorporated in aviation systems. Environmental conditions will play a large role in the design space and limitations of potential cooling solutions and will dictate the effectiveness of current thermal management systems. In arising scenarios where high-density electronics cannot be contained within a pressurized and temperature-controlled cabin, drastic pressure and temperature swings, facilitated by the external environment, will lead to an extra source of fluctuating stress on the cooling system. This is likely to be a prevalent factor in hybrid-electric and all-electric powertrains as requiring environmental controlled spaces for major components could be limited. This can easily be seen in current attempts to examine and redesign local cooling systems for electric motors in aviation. Representing just one of the major cooling requirements on an electric aircraft, motor cooling systems demonstrate the universal cooling problems limiting all aspects of the powertrains system. This paper aims to define the impact of the changing environment, through a flight profile of an aircraft, on high density electronic cooling systems by assessing the potential system stressors that significantly impact performance, efficiency, and reliability of the cooling systems. It will also utilize local cooling efforts for motors to relate the general problems to applicable design considerations that must be understood to further the performance capability of the overall propulsion system.

Pool Boiling Performance of Multilayer Micromeshes for Commercial High-Power Cooling

With the rapid development of electronics, thermal management has become one of the most crucial issues. Intense research has focused on surface modifications used to enhance heat transfer. In this study, multilayer copper micromeshes (MCMs) are developed for commercial compact electronic cooling. Boiling heat transfer performance, including critical heat flux (CHF), heat transfer coefficients (HTCs), and the onset of nucleate boiling (ONB), are investigated. The effect of micromesh layers on the boiling performance is studied, and the bubbling characteristics are analyzed. In the study, MCM-5 shows the highest critical heat flux (CHF) of 207.5 W/cm2 and an HTC of 16.5 W(cm2·K) because of its abundant micropores serving as nucleate sites, and outstanding capillary wicking capability. In addition, MCMs are compared with other surface structures in the literature and perform with high competitiveness and potential in commercial applications for high-power cooling.