Transmission electron microscopy study of the failure mechanism of the diffusion barriers (TiN and TaN) between Al and Cu

2017 ◽  
Vol 23 (1) ◽  
pp. 141-147
Author(s):  
Soo-Hyun Kim
1994 ◽  
Vol 70 (5) ◽  
pp. 1077-1094 ◽  
Author(s):  
J. J. Couderc ◽  
S. Fritsch ◽  
M. Brieu ◽  
G. Vanderschaeve ◽  
M. Fagot ◽  
...  

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