Experimental Investigation for Generation of Micro-Holes on Silicon Wafer Using Electrochemical Discharge Machining Process

Silicon ◽  
2019 ◽  
Vol 12 (7) ◽  
pp. 1683-1689 ◽  
Author(s):  
Manpreet Singh ◽  
Sarbjit Singh ◽  
Sanjeev Kumar
Author(s):  
Manpreet Singh ◽  
Sarbjit Singh

Electrochemical discharge machining has been proved to be efficient micro-machining process and significantly used for the machining of non-conductive materials. The miniaturized products have gained advantages in Lab-on-a-chip devices and microelectromechanical system because of advancement in technology. The challenge to produce micro features has been suitably addressed by electrochemical discharge machining and emerged as potential contender in generating micro holes and micro channels on electrically non-conductive materials. This article includes state-of-art review on different domains of electrochemical discharge machining, which includes work piece, electrolyte, behaviour of tool electrode, gas film formation, machining quality along with recent hybridizations in electrochemical discharge machining process. The conclusion focuses or summarizes the future research trends for enhancement of electrochemical discharge machining efficiency and tackles problems encountered in machining.


Processes ◽  
2019 ◽  
Vol 7 (4) ◽  
pp. 195 ◽  
Author(s):  
Yong Liu ◽  
Chao Zhang ◽  
Songsong Li ◽  
Chunsheng Guo ◽  
Zhiyuan Wei

Electrochemical discharge machining (ECDM) is one effective way to fabricate non-conductive materials, such as quartz glass and ceramics. In this paper, the mathematical model for the machining process of ECDM was established. Then, sets of experiments were carried out to investigate the machining localization of ECDM with a rotating helical tool on ultra-clear glass. This paper discusses the effects of machining parameters including pulse voltage, duty factor, pulse frequency and feed rate on the side gap under different machining methods including electrochemical discharge drilling, electrochemical discharge milling and wire ECDM with a rotary helical tool. Finally, using the optimized parameters, ECDM with a rotary helical tool was a prospective method for machining micro holes, micro channels, micro slits, three-dimensional structures and complex closed structures with above ten micrometers side gaps on ultra-clear glass.


2018 ◽  
Vol 26 (7) ◽  
pp. 1653-1660
Author(s):  
刘 勇 LIU Yong ◽  
魏志远 WEI Zhi-yuan ◽  
邓世辉 DENG Shi-hui ◽  
李松松 LI Song-song

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