Test Time Reduction in Automated Test Equipment (ATE)-Based Mechanism of Network-on-Chip Communication Infrastructure

2015 ◽  
Vol 40 (11) ◽  
pp. 3197-3209
Author(s):  
Mona Soleymani ◽  
Midia Reshadi

2005 ◽  
Author(s):  
A.M. Amory ◽  
M. Lubaszewski ◽  
F.G. Moraes ◽  
E.I. Moreno




2021 ◽  
Vol 35 (3) ◽  
pp. 265-271
Author(s):  
Gokul Chandrasekaran ◽  
Gopinath Singaram ◽  
Rajkumar Duraisamy ◽  
Akash Sanjay Ghodake ◽  
Parthiban Kunnathur Ganesan

System-on-Chip (SoC) is an integration of electronic components and billions of transistors. Defects due to the base material is caused during the manufacturing of components. To overcome these issues testing of chips is necessary but total cost increases because of increasing test time. The main issues to be considered during testing of SoC are the time taken for testing and accessibility of core. Effective test scheduling should be done to minimize testing time. In this paper, an effective test scheduling mechanism to minimize testing time is proposed. The test time reduction causes test cost reduction. The Enhanced Firefly algorithm is used in this paper to minimize test time. Enhanced Firefly algorithm gives a better result than Ant colony and Firefly algorithms in terms of test time reduction thereby reduction test cost takes place.



Author(s):  
Carl M. Nail

Abstract Dice must often be removed from their packages and reassembled into more suitable packages for them to be tested in automated test equipment (ATE). Removing bare dice from their substrates using conventional methods poses risks for chemical, thermal, and/or mechanical damage. A new removal method is offered using metallography-based and parallel polishing-based techniques to remove the substrate while exposing the die to minimized risk for damage. This method has been tested and found to have a high success rate once the techniques are learned.







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