Circular Economy and Adhesive Bonding Technology, Part 1

Adhesive bonding is one of many materials connecting methods. In the last ten years periods the bonding technology noted a boom almost in all industrial branches. The use of bonding technology in the engineering and repairing industry brings considerable savings. Saving in costs, in critical metallic materials and in time are reached and the decrease of the joint weight, too. Therefore the bonding technology pertains to the modern jointing methods even though it is a very old technique. The adhesive bonding technology is influenced by a number of factors which affect the adhesive bond strength. Correcting coefficients have to be considered in construction calculations too. The correcting coefficients correct the strength deviations caused by particular factors. In the paper there are published laboratory experiments results.

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Electronics in Textiles – Adhesive Bonding Technology for Reliably Embedding Electronic Modules into Textile Circuits

Advances in Science and Technology ◽

10.4028/www.scientific.net/ast.85.1 ◽

2012 ◽

Vol 85 ◽

pp. 1-10 ◽

Cited By ~ 13

Author(s):

Malte von Krshiwoblozki ◽

Torsten Linz ◽

Andreas Neudeck ◽

Christine Kallmayer

Keyword(s):

Adhesive Bonding ◽

Conductive Adhesive ◽

Mechanical Contact ◽

Smart Textiles ◽

Contact Formation ◽

Main Challenge ◽

Bonding Technology

The interconnection of electronics and textile circuits is still a main challenge for the fabrication of reliable smart textiles. This paper investigates the thermoplastic adhesive bonding technology. Electronic modules are bonded to textile substrates with a thermoplastic non-conductive adhesive (NCA) film. The modules are placed onto textile circuits with an NCA-film in-between. By applying pressure and heat, the adhesive melts and contact partners touch. Subsequently cooling solidifies the NCA resulting in an electrical and mechanical contact of the electronic module and the textile circuit. This paper shows the suitability of this technology for knitted, woven, non-woven and embroidered fabrics with metal coated yarns as well as with litz-wires as conductors. Besides, it shows that the interconnection process works well with thermoplastically insulated conductors. In addition, the design of interposers has been improved in respect to contact formation and miniaturization compared to previous publications. The pitch of the contact pads is set to 1.27 mm. A textile display was realized with smart RGB-Pixels, which are controlled by an I²C-bus on a quadrupolic woven substrate. It demonstrates the applicability and the potential of this technology.

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Adhesive Bonding

Using Lasers as Safe Alternatives for Adhesive Bonding - Advances in Chemical and Materials Engineering ◽

10.4018/978-1-7998-4634-5.ch001 ◽

2020 ◽

pp. 1-25

Keyword(s):

Adhesive Bonding ◽

Adhesive Bond ◽

Bonding Process ◽

Manufacturing Processes ◽

Adhesive Bonds ◽

Different Types ◽

Bonding Technology ◽

Basic Concepts

This chapter presents the application of adhesive bonding technology with a long tradition of use in manufacturing processes. It has an established position among a number of different ways of permanently joining elements together. This work offers a list of many advantages of this technology, alongside the difficulties and limitations in the use of adhesive bonds. The basic concepts of adhesives and their components are described, and the terms related to the bonding process are presented. Attention was paid to the great variety of adhesives and many different criteria of their division and selection to a particular technological situation. In the following chapter, examples of the application of different types of adhesives with regard to using materials and constructions can be found as well as methods and requirements for the preparation of the finished adhesive. Mechanisms of the formation of an adhesive bond are characterized, and various constructions of adhesive bonds that are necessary to form a durable bond of elements are presented.

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