Manufacturing of 3D Microlens Array Mold on Bulk Metallic Glass by Self-Aligned Multi-Ball Hot Embossing

Author(s):  
Xiaohua Liu ◽  
Ruodong Mo ◽  
Kangsen Li ◽  
Jun Shen ◽  
Jiang Ma ◽  
...  
2012 ◽  
Vol 510 ◽  
pp. 639-644 ◽  
Author(s):  
Xiang Zhang ◽  
Jiang Ma ◽  
Ran Bai ◽  
Qian Li ◽  
Bing Li Sun ◽  
...  

Polymer microstructures are used more and more in many fields. Hot embossing is one of molding processing to achieve micro polymer components. In this paper, bulk metallic glass was selected as mold material to fabricate mold insert of micro hot embossing. Traditional UV-lithography and ICP-etching were used to achieve micro features on silicon wafer. And then, micro features were transferred from silicon wafer to bulk metallic glass mold insert above its glass transition temperature. Finally, applied bulk metallic glass mold insert to replicate polymer microstructure with hot embossing. Three commonly used thermoplastic polymers: high-density polyethylene (HDPE), polypropylene (PP) and polycarbonate (PC) were selected in this study. Experiments show that microstructures can have a good replication from bulk metallic glass mold insert to the thermoplastic polymer using hot embossing.


2008 ◽  
Vol 141 (2) ◽  
pp. 422-431 ◽  
Author(s):  
C.T. Pan ◽  
T.T. Wu ◽  
M.F. Chen ◽  
Y.C. Chang ◽  
C.J. Lee ◽  
...  

2012 ◽  
Vol 21 (1) ◽  
pp. 50-55 ◽  
Author(s):  
J.J. He ◽  
N. Li ◽  
N. Tang ◽  
X.Y. Wang ◽  
C. Zhang ◽  
...  

2015 ◽  
Vol 2015 ◽  
pp. 1-8 ◽  
Author(s):  
Zhijing Zhu ◽  
Chuanyun Yi ◽  
Tielin Shi ◽  
Yichun Zhang ◽  
Yang Gao ◽  
...  

We demonstrated hot embossing of Zr65Cu17.5Ni10Al7.5bulk metallic glass micropart using stacked silicon dies. Finite element simulation was carried out, suggesting that it could reduce the stress below 400 MPa in the silicon dies and enhance the durability of the brittle silicon dies when using varying load mode (100 N for 60 s and then 400 N for 60 s) compared with using constant load mode (200 N for 120 s). A micropart with good appearance was fabricated under the varying load, and no silicon die failure was observed, in agreement with the simulation. The amorphous state of the micropart was confirmed by differential scanning calorimeter and X-ray diffraction, and the nanohardness and Young’s modulus were validated close to those of the as-cast BMG rods by nanoindentation tests. The results proved that it was feasible to adopt the varying load mode to fabricate three-dimensional Zr-based bulk metallic glass microparts by hot embossing process.


2009 ◽  
Vol 484 (1-2) ◽  
pp. 118-122 ◽  
Author(s):  
D. Wang ◽  
G. Liao ◽  
J. Pan ◽  
Z. Tang ◽  
P. Peng ◽  
...  

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