Material Modeling of PMMA Film for Hot Embossing Process

This study provides an analysis of the hot embossing process with poly methyl methacrylate (PMMA) film. The hot embossing process engraves a fine pattern on a flexible film using a stamp, applied heat and pressure. As the quality of the embossing pattern varies according to various process variables, the mechanism of making the embossed shape is complicated and difficult to analyze. Therefore, analysis takes much time and cost because it usually has to perform a lot of experiments to find an appropriate process condition. In this paper, the hot embossing process was analyzed using a computational analysis method to quickly find the optimal process. To do this, we analyzed the embossing phenomenon using the finite element method (FEM) and arbitrary Lagrangian–Eulerian (ALE) re-mesh technique. For this purpose, we developed a constitutive model considering the strain, strain rate, temperature-dependent stress and softening of the flexible film. Work hardening, strain softening, and temperature-softening behavior of PMMA materials were well described by the proposed method. The developed constitutive model were applied in the embossing analysis via user-subroutine. This proposed method allowed a precise analysis of the phenomenon of film change during the hot embossing process.

Design of Precision Hot Embossing Machine for Micro-Patterning on PMMA

A microfluidic chip requires micro-channels to be created on a substrate. This paper focuses on the design and development of a precision hot embossing machine for replication of microstructures on a PMMA substrate. Kinematic coupling using three spherical balls in radial v-grooves is used to achieve precise positioning of the mold insert with the base. Flexure based parallel guidance mechanism is used for one DOF motion required for the embossing process. The mechanism allows the motion of the mold normal to the substrate surface. Flexure based kinematic coupling with the thermal center is designed to mitigate thermal stress build-up during heating and cooling of the mold insert. An Arduino-based micro-controller is developed to control the temperature profile during the process. A prototype is fabricated and experiments are performed with an aluminium mold insert on a PMMA substrate. The result shows the feasibility of the concept and the set-up can be used to develop a cost-effective precision hot embossing machine for creating micro-patterns for microfluidic applications.

Influence of Distribution Size of Micro Energy Director Array on Ultrasonic Precise Sealing of Polymer MEMS Device

In order to improve the quality and precision of ultrasonic precision sealing of polymer MEMS device, micro energy director array was proposed on the sealing surface of polymer MEMS device, the influence of the distribution size of micro energy director array to ultrasonic precise sealing was studied. Based on the experiment of PMMA micro-pipe sealing, five kinds of micro energy directors with different distribution sizes were made on the sealing surface by hot embossing technique. The method of ultrasonic precise sealing based on efficiency’s feedback was used and the influence of micro energy director array’s distribution size on the quality of ultrasonic sealing was summarized through the observation on the rule of wetting behavior of micro energy director array.