Process of making ceramic composites with improved thermal shock resistance

Composites ◽  
1990 ◽  
Vol 21 (3) ◽  
pp. 273
2001 ◽  
Vol 21 (8) ◽  
pp. 999-1005 ◽  
Author(s):  
Pernilla Pettersson ◽  
Zhijian Shen ◽  
Mats Johnsson ◽  
Mats Nygren

2007 ◽  
Vol 544-545 ◽  
pp. 391-394 ◽  
Author(s):  
Hai Yun Jin ◽  
Guan Jun Qiao ◽  
Ji Qiang Gao

The SiC/h-BN ceramic composites with different h-BN size were fabricated by Plasma Active Sintering (PAS) method. For the SiC/ nano-sized h-BN ceramic composites, when the h-BN content was increased, because the nano-sized h-BN crystals were homogeneously dispersed around the SiC grains of the matrix, the bending strength and fracture toughness of the composites decreased slowly, but the hardness decreased sharply, therefore the machinability and thermal shock resistance were improved noticeable.


2018 ◽  
Vol 784 ◽  
pp. 73-78
Author(s):  
Alexandra Kovalčíková ◽  
Michal Húlan ◽  
Richard Sedlák ◽  
Martin Fides ◽  
Csaba Balázsi ◽  
...  

Si3N4/hBN composites were fabricated by hot isostatic pressing at 1700°C/3h with 1, 3 and 5 wt. % micro-sized or nano-sized hexagonal boron nitride particles added to silicon nitride matrix. An indentation quench test method was used for estimation of thermal shock resistance of monolithic Si3N4and Si3N4/hBN composites. Thermal shock resistance of the composites increased with the increase of size and volume of hBN particles. The critical temperature difference for the composites with micro-sized hBN was significantly higher (over 900°C) compared to the monolithic silicon nitride (580°C).


2005 ◽  
Vol 81 (7) ◽  
pp. 1888-1892 ◽  
Author(s):  
Joachim H. Schneibel ◽  
Stephen M. Sabol ◽  
Jay Morrison ◽  
Evan Ludeman ◽  
Cecil A. Carmichael

2018 ◽  
Vol 15 (6) ◽  
pp. 1358-1365 ◽  
Author(s):  
Yangshan Sun ◽  
Delong Cai ◽  
Zhihua Yang ◽  
Qian Li ◽  
Hailiang Li ◽  
...  

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