Thermal degradation of a diglycidyl ether of bisphenol A/1,3-bisaminomethylcyclohexane (DGEBA/1,3-BAC) epoxy resin system

1995 ◽  
Vol 269-270 ◽  
pp. 253-259 ◽  
Author(s):  
L. Barral ◽  
J. Cano ◽  
A.J. López ◽  
J. Lopez ◽  
P. Nógueira ◽  
...  
Keyword(s):  
Thermal Degradation ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Diglycidyl Ether ◽  
Resin System ◽  
Epoxy Resin System

Study on curing kinetics of a diglycidyl ether of bisphenol A epoxy resin/microencapsulated curing agent system

2012 ◽  
Vol 24 (8) ◽  
pp. 730-737 ◽  
Author(s):  
Wang Fang ◽  
Xiao Jun ◽  
Wang Jing-wen ◽  
Li Shu-qin
Keyword(s):  
Particle Size ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Diglycidyl Ether ◽  
Wall Material ◽  
Curing Agent ◽  
Resin System ◽  
Scanning Calorimetry ◽  
Cure Reaction ◽  
Epoxy Resin System

A modified imidazole curing agent, EMI-g-BGE, was encapsulated for one-package of diglycidyl ether of bisphenol A (DGEBA) epoxy resin system. Polyetherimide (PEI) was used as the wall material, and the emulsion solvent evaporation method was used to form the microcapsules. The morphology and particle size distribution of microcapsules were evaluated by scanning electron microscopy (SEM), mastersizer analyzer. Microcapsules exhibited spherical shapes and the mean particle size was about 745 nm. The curing kinetic of DGEBA/microcapsules curing agent was studied by nonisothermal differential scanning calorimetry (DSC) technique at different heating rates. Dynamic DSC scans indicated the microcapsule was an effective curing agent of epoxy resin. The apparent activation energy Ea was 88.03 kJ/mol calculated through Kissinger method, more than DGEBA/EMI-g-BGE system. This microcapsule of EMI-g-BGE exhibited a long shelf life, and the curing did not occur in this epoxy-microcapsule resin system for more than 3months at room temperature. The kinetic parameters were determined by Málek method and a two-parameter ( m, n) autocatalytic model (Šesták–Berggren equation) was found to be the most adequate selected kinetic model, which showed the encapsulation of the curing agent EMI-g-BGE did not change the cure reaction mechanism of the epoxy resin system. From the experimental data, the nonisothermal DSC curves show the results being in accordant with those theoretically calculated.

Water absorption of a diglycidyl ether of bisphenol A/1,3-bisaminomethylcyclohexane (DGEBA/1,3-BAC) epoxy resin system

1996 ◽  
Vol 47 (3) ◽  
pp. 791-797 ◽  
Author(s):  
L. Barral ◽  
J. Cano ◽  
A. J. López ◽  
J. López ◽  
P. Nogueira ◽  
...  
Keyword(s):  
Bisphenol A ◽  
Water Absorption ◽  
Epoxy Resin ◽  
Diglycidyl Ether ◽  
Resin System ◽  
Epoxy Resin System

Novel Bismaleimide–Epoxy Resin System: II

1996 ◽  
Vol 8 (2) ◽  
pp. 233-242
Author(s):  
Hasmukh S Patel ◽  
Sanket N Shah
Keyword(s):  
Epoxy Resin ◽  
Average Molecular Weight ◽  
Conductometric Titration ◽  
Diglycidyl Ether ◽  
Spectral Studies ◽  
Reinforced Composites ◽  
Resin System ◽  
Number Average Molecular Weight ◽  
Scanning Calorimetry ◽  
Epoxy Resin System

Novel diamines, namely N, N′-bis[1-(2-methyl-4-aminophenyl)ethanonyl]-1,4- benzenediamine (BMAED 1) and N, N′-bis[1-(4-methyl-3-animophenyl)ethanonyl]-1,4-benzenediamine (BMAED 2), have been prepared and reacted with various bismaleimides (BM) at a BM:diamine ratio of 1:2. The resulting oligoimides have been characterized by elemental analysis, IR spectral studies and the number average molecular weight ( Mn) estimated by non-aqueous conductometric titration and thermogravimetry. Some of the oligomides have been modified by addition (i.e. curing reaction) of epoxy resin, namely the diglycidyl ether of bisphenol-A, and studied by differential scanning calorimetry (DSC). The glass- and carbon-reinforced composites have also been prepared and characterized by their mechanical properties.

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