Numerical simulation of grain-boundary grooving by surface diffusion

In the sintering of ceramics, cracks are inevitably encountered after sintering. But very few studies have been presented in the literature for qualifying and quantifying effects of inhomogeneity on sintering kinetics. Therefore, a series of detailed sintering variables such as grain size, surface tension and diffusivity are chosen to study the effects of their inhomogeneity on sintering kinetics through a computational model calculated by computer.Furthermore, there are two main achievements in this computational model that first one is providing a numerical solution for the curvature at triple junction (pore tip) of microscopic particles, and second one is considering the effect of surface diffusion on first-stage sintering where diffusion mechanism is coupled by grain-boundary and surface diffusion.

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Micromechanics of formation and shrinkage of a closed pore in sintering by coupled grain boundary/surface diffusion

Journal of the European Ceramic Society ◽

10.1016/j.jeurceramsoc.2019.03.022 ◽

2019 ◽

Vol 39 (9) ◽

pp. 2952-2959 ◽

Cited By ~ 2

Author(s):

Fumihiro Wakai ◽

Gaku Okuma ◽

Norimasa Nishiyama ◽

Olivier Guillon

Keyword(s):

Grain Boundary ◽

Surface Diffusion ◽

Boundary Surface ◽

Closed Pore

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A new Insight into the Electromigration Behavior of Copper Interconnects: The Roles of Grain Boundary and Surface Diffusion

Defect and Diffusion Forum ◽

10.4028/www.scientific.net/ddf.143-147.1673 ◽

1997 ◽

Vol 143-147 ◽

pp. 1673-1678 ◽

Cited By ~ 3

Author(s):

Evgeny E. Glickman ◽

M. Nathan

Keyword(s):

Grain Boundary ◽

Surface Diffusion ◽

Copper Interconnects ◽

Insight Into

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The Effect of Grain Boundaries on Surface Diffusion Mediated-Planarization of Polycrystalline Cu Films

MRS Proceedings ◽

10.1557/proc-389-107 ◽

1995 ◽

Vol 389 ◽

Cited By ~ 3

Author(s):

R.A. Brain ◽

D.S. Gardner ◽

D.B. Fraser ◽

H.A. Atwater

Keyword(s):

Grain Boundary ◽

Grain Boundaries ◽

Surface Diffusion ◽

Cross Sections ◽

Boundary Surface ◽

Surface Profile ◽

Transmission Electron Micrograph ◽

Cu Films ◽

Transmission Electron

ABSTRACTIn situ, ultrahigh vacuum anneals were performed to induce Cu reflow at 500°C following deposition of Cu films and a Ta barrier layer on 1 μm wide by 1 μm deep trenches. Transmission electron micrograph cross-sections show profiles which suggest that grain boundaries and surface energy anisotropy significantly affect reflow. The extent of reflow is dependent on the structure of grain boundary-surface intersections, and the surface profile consists of regions of low curvature within grains and with sharp discontinuities in curvature at grain boundaries, a structure that inhibits surface diffusion. We present results showing how the surface diffusion mediated reflow varies with grain boundary groove angle and position, and compare these results with finite-element simulations that model surface diffusion-driven reflow.

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