NON-DESTRUCTIVE EVALUATION OF CERAMICS BY SCANNING ACOUSTIC MICROSCOPY

1989 ◽  
pp. 747-752 ◽  
Author(s):  
U. Stelwagen ◽  
P.P.J. Ramaekers ◽  
P.P. van't Veen ◽  
L.F. van der Wal
2018 ◽  
Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Stefan Oberhoff ◽  
Michael Wiedenmann ◽  
...  

Abstract GHz scanning acoustic microscopy (GHz-SAM) was successfully applied for non-destructive evaluation of the integrity of back end of line (BEOL) stacks located underneath wire-bond pads. The current study investigated two sample types of different IC processes. Realistic bonding defects were artificially induced into samples and the sensitivity of the acoustic GHz-microscope towards defects in BEOL systems was studied. Due to the low penetration depth in the acoustic GHz regime, a specific sample preparation was conducted in order to provide access to the region of interest. However, the preparation stopped several microns above the interfaces of interest, thus avoiding preparation artifacts in the critical region. Cratering related cracks in the bond pads have been imaged clearly by GHz-SAM. The morphology of the visualized defects corresponded well with the results obtained by a chemical cratering test. Moreover, delamination defects at the interface between ball and pad metallization were detected and successfully identified. The current paper demonstrates non-destructive inspection for bond-pad cratering and ball-bond delamination using highly focused acoustic waves in the GHz-band and thus illustrates the analysis of micron-sized defects in BEOL layer structures that are related to wire bonding or test needle imprints.


2019 ◽  
Vol 91 (10) ◽  
pp. 7-15
Author(s):  
Tomasz Piwowarczyk ◽  
Marcin Korzeniowski ◽  
Dawid Majewski

This article explores the possibilities of using non-destructive ultrasonic techniques to analyze the quality of lapped braze-welded joints. The tests were performed for 4 material groups (DC03+ZE steel and X5CrNi18-19 steel, aluminum alloys AW-5754 and AW-6061, titanium Grade 2 and copper Cu-ETP). As part of the work, additional materials and joint processes and its parameters were selected (TIG, MIG, laser). The quality of joints was monitored using scanning acoustic microscopy. Based on the A-scan andC-scan images, potential joints imperfections were determined. The possibilities of using advanced ultrasonic techniques to analyze the quality of braze joints was assessed.


2020 ◽  
Vol 6 ◽  
pp. 100035 ◽  
Author(s):  
L. Pitta Bauermann ◽  
L.V. Mesquita ◽  
C. Bischoff ◽  
M. Drews ◽  
O. Fitz ◽  
...  

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