Copper Diffusion Rates and Hopping Pathways in Superionic Cu2Se

2021 ◽  
pp. 117026
Author(s):  
Sheik Md Kazi Nazrul Islam ◽  
Prince Mayank ◽  
Yulou Ouyang ◽  
Jie Chen ◽  
Arun. K. Sagotra ◽  
...  
2020 ◽  
Author(s):  
Sheik Md Kazi Nazrul Islam ◽  
Prince Mayank ◽  
Yulou Ouyang ◽  
Jie Chen ◽  
Arun. K. Sagotra ◽  
...  

Author(s):  
Terry Riss ◽  
O. Joseph Trask

AbstractAlong with the increased use of more physiologically relevant three-dimensional cell culture models comes the responsibility of researchers to validate new assay methods that measure events in structures that are physically larger and more complex compared to monolayers of cells. It should not be assumed that assays designed using monolayers of cells will work for cells cultured as larger three-dimensional masses. The size and barriers for penetration of molecules through the layers of cells result in a different microenvironment for the cells in the outer layer compared to the center of three-dimensional structures. Diffusion rates for nutrients and oxygen may limit metabolic activity which is often measured as a marker for cell viability. For assays that lyse cells, the penetration of reagents to achieve uniform cell lysis must be considered. For live cell fluorescent imaging assays, the diffusion of fluorescent probes and penetration of photons of light for probe excitation and fluorescent emission must be considered. This review will provide an overview of factors to consider when implementing assays to interrogate three dimensional cell culture models.


Systems ◽  
2021 ◽  
Vol 9 (1) ◽  
pp. 16
Author(s):  
Albert Joseph Parvin ◽  
Mario G. Beruvides

Macro-level trends and patterns are commonly used in business, science, finance, and engineering to provide insights and estimates to assist decision-makers. In this research effort, macro-level trends and patterns were explored on the diffusion rates of technological innovations, a component of a sorely under-studied question in technology assessment: When should a technological innovation be abandoned? A quantitative exploratory data analysis (EDA)-based approach was employed to examine diffusion market data of 42 U.S. consumer technological innovations from the early 1900s to the 2010s to extract general macro-level knowledge on technological innovation diffusion rates. A goal of this effort is to grow diffusion rate knowledge to enable the development of general macro-based forecasting tools. Such tools would aid decision-makers in making informed and proactive decisions on when to abandon a technological innovation. This research offers several significant contributions to the macro-level understanding of the boundaries and likelihood of achieving a range of technological innovation diffusion rates. These contributions include the determination that the frequency of diffusion rates are positively skewed when ordered from slowest to fastest, and the identification and ranking of probability density functions that best represent the rates of technological innovation diffusion.


2006 ◽  
Author(s):  
C. E. Close ◽  
M. R. Gleeson ◽  
J. V. Kelly ◽  
F. T. O'Neill ◽  
D. Mooney ◽  
...  
Keyword(s):  

2013 ◽  
Vol 13 (15) ◽  
pp. 7813-7824 ◽  
Author(s):  
R. L. Gattinger ◽  
E. Kyrölä ◽  
C. D. Boone ◽  
W. F. J. Evans ◽  
K. A. Walker ◽  
...  

Abstract. Observations of the mesospheric semi-annual oscillation (MSAO) in the equatorial region have been reported dating back several decades. Seasonal variations in both species densities and airglow emissions are well documented. The extensive observations available offer an excellent case study for comparison with model simulations. A broad range of MSAO measurements is summarised with emphasis on the 80–100 km region. The objective here is not to address directly the complicated driving forces of the MSAO, but rather to employ a combination of observations and model simulations to estimate the limits of some of the underlying dynamical processes. Photochemical model simulations are included for near-equinox and near-solstice conditions, the two times with notable differences in the observed MSAO parameters. Diurnal tides are incorporated in the model to facilitate comparisons of observations made at different local times. The roles of water vapour as the "driver" species and ozone as the "response" species are examined to test for consistency between the model results and observations. The simulations suggest the interactions between vertical eddy diffusion and background vertical advection play a significant role in the MSAO phenomenon. Further, the simulations imply there are rigid limits on vertical advection rates and eddy diffusion rates. For August at the Equator, 90 km altitude, the derived eddy diffusion rate is approximately 1 × 106 cm2 s−1 and the vertical advection is upwards at 0.8 cm s−1. For April the corresponding values are 4 × 105 cm2 s−1 and 0.1 cm s−1. These results from the current 1-D model simulations will need to be verified by a full 3-D simulation. Exactly how vertical advection and eddy diffusion are related to gravity wave momentum as discussed by Dunkerton (1982) three decades ago remains to be addressed.


2013 ◽  
Vol 1559 ◽  
Author(s):  
Paul Gondcharton ◽  
Floriane Baudin ◽  
Lamine Benaissa ◽  
Bruno Imbert

ABSTRACTWafer level metal bonding involving copper material is widely used to achieve 3D functional integration of ICs and ensure effective packaging sealing for various applications. In this paper we focus on thermocompression bonding technology where temperature and pressure are used in parallel to assist the bonding process. More specifically a broad range of conditions was explored and interesting results were observed and are reported. Indeed, despite a relatively high roughness, the presence of a native oxide and the lack of surface preparation, there still exists a process window where wafer level bonding is allowed. In these conditions, limiting the bonding mechanisms to basic copper diffusion is no longer satisfactory. In this study, a specific scenario inspired by both wafer bonding and metal welding state of the art is put forward. Accordingly, pure copper diffusion through the bonding interface is lined with plastic deformation and metallic oxide fracture. In addition, polycrystalline film deformation due to thermomechanical stress is highlighted and grain growth and voiding formation are observed and confirmed.


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