Thermal performance analysis of a microchannel heat sink cooling with copper oxide-indium (CuO/In) nano-suspensions at high-temperatures

2018 ◽  
Vol 137 ◽  
pp. 700-709 ◽  
Author(s):  
M.M. Sarafraz ◽  
M. Arjomandi
Keyword(s):  
Performance Analysis ◽  
Copper Oxide ◽  
High Temperatures ◽  
Thermal Performance ◽  
Heat Sink ◽  
Microchannel Heat Sink

Thermal performance analysis by different material characteristics of electronics cooling heat sink

2019 ◽  
Vol 33 (1) ◽  
pp. 41-45
Author(s):  
Eui-Hyeok Song ◽  
RIGUANG CHI ◽  
Dae-Gyeom Yu ◽  
Seok-Ho Rhi ◽  
Dong-Ju Lee ◽  
...  
Keyword(s):  
Performance Analysis ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronics Cooling ◽  
Material Characteristics

Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow Arrangement

2011 ◽  
Vol 8 (1) ◽  
pp. 16-22 ◽  
Author(s):  
Pradeep Hegde ◽  
Mukesh Patil ◽  
K. N. Seetharamu
Keyword(s):  
Finite Element ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Element Model ◽  
Channel Length ◽  
Computational Time ◽  
Microchannel Heat Sink ◽  
Method Performance

Thermal performance of a water cooled multistack microchannel heat sink with counterflow arrangement has been analyzed using the finite element method. Performance parameters such as thermal resistance, pressure drop, and pumping power are computed for a typical counterflow heat sink with different number of stacks. The temperature distribution in a typical multistack counterflow microchannel heat sink is obtained for different numbers of stacks and plotted along the channel length. A parametric study involving the effects of number of stacks and channel aspect ratio on thermal resistance and pressure drop of the heat sink is done. The finite element model developed for the analysis is simple and consumes less computational time.

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