Effect of microchannel heat sink configuration on the thermal performance and pumping power

Author(s):  
M.P. Vasilev ◽  
R.Sh. Abiev ◽  
R. Kumar
2016 ◽  
Vol 78 (10-2) ◽  
Author(s):  
Nik Ahmad Faiz Nik Mazlam ◽  
Normah Mohd-Ghazali ◽  
Thierry Mare ◽  
Patrice Estelle ◽  
Salma Halelfadl

The microchannel heat sink (MCHS) has been established as an effective heat removal system in electronic chip packaging. With increasing power demand, research has advanced beyond the conventional coolants of air and water towards nanofluids with their enhanced heat transfer capabilities. This research had been carried out on the optimization of the thermal and hydrodynamic performance of a rectangular microchannel heat sink (MCHS) cooled with carbon nanotube (CNT) nanofluid, a coolant that has recently been discovered with improved thermal conductivity. Unlike the common nanofluids with spherical particles, nanotubes generally come in cylindrical structure characterized with different aspect ratios. A volume concentration of 0.1% of the CNT nanofluid is used here; the nanotubes have an average diameter and length of 9.2 nm and 1.5 mm respectively. The nanofluid has a density of 1800 kg/m3 with carbon purity 90% by weight having lignin as the surfactant. The approach used for the optimization process is based on the thermal resistance model and it is analyzed by using the non-dominated sorting multi-objective genetic algorithm. Optimized outcomes include the channel aspect ratio and the channel wall ratio at the optimal values of thermal resistance and pumping power. The optimized results show that, at high operating temperature of 40°C the use of CNT nanofluid reduces the total thermal resistance by 3% compared to at 20°C and consequently improve the thermal performance of the fluid. In terms of the hydrodynamic performance, the pumping power is also being reduced significantly by 35% at 40°C compared to the lower operating temperature.  


Author(s):  
Ed Walsh ◽  
Pat Walsh ◽  
Ronan Grimes ◽  
Vanessa Egan

There is an increasing need for low profile thermal management solutions for applications in the range of five to ten watts targeted at portable electronic devices. This need is emerging due to enhanced power dissipation levels in portable electronics. This work focuses upon the optimization of such a solution within certain constraints of profile and footprint area. A number of fan geometries have been investigated where both the inlet and exit rotor angles are varied relative to the heat conducting fins on a heat sink. The ratio of fan diameter to heat sink fin length was also varied. The objective was to determine the optimal solution from a thermal management perspective within defined constraints. The results show good thermal performance for low profile thermal management solutions, and highlight the need to develop the heat sink and fan as an integrated thermal solution rather than in isolation as is the traditional methodology. It is also found that while increasing pumping power generally improves the thermal performance, only small gains are achieved for relatively large pumping power increases. This is important in optimizing portable systems which are powered by limited battery life.


2011 ◽  
Vol 8 (1) ◽  
pp. 16-22 ◽  
Author(s):  
Pradeep Hegde ◽  
Mukesh Patil ◽  
K. N. Seetharamu

Thermal performance of a water cooled multistack microchannel heat sink with counterflow arrangement has been analyzed using the finite element method. Performance parameters such as thermal resistance, pressure drop, and pumping power are computed for a typical counterflow heat sink with different number of stacks. The temperature distribution in a typical multistack counterflow microchannel heat sink is obtained for different numbers of stacks and plotted along the channel length. A parametric study involving the effects of number of stacks and channel aspect ratio on thermal resistance and pressure drop of the heat sink is done. The finite element model developed for the analysis is simple and consumes less computational time.


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