Fabrication and dielectric properties of BADCy/Ni0.5Ti0.5NbO4 composites for ultra-low-loss printed circuit board application

A novel ceramic-functional-particle-filled polymer composite material has been developed for the use either in discrete elements on the printed circuit board or in being embedded within the packaging substrate for high frequency circuit applications. This material provides the desired properties such as low loss at high frequencies, about 0.002 or less up to 10GHz, and high dielectric strength, among other improved properties. The electrical properties were influenced significantly by the ceramic-functional-particle, i.e. type and particle size/distribution in the polymer matrix. Their contributions to the electric strength and temperature stability of capacitance which is an important material issue for practical device application will be discussed. In addition, capacitance tolerance for manufacturing embedded RF capacitor will be presented in terms of etching uniformity to minimize the variation of the capacitor electrode areas.

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Extremely Low-Loss Planar Transition From Hollow Dielectric Waveguide to Printed Circuit Board for Millimeter-Wave Interconnect

IEEE Transactions on Microwave Theory and Techniques ◽

10.1109/tmtt.2021.3087176 ◽

2021 ◽

pp. 1-1

Author(s):

Chung-Yuan Liu ◽

Hsiang-En Ding ◽

Shih-Hsien Wu ◽

Tzong-Lin Wu

Keyword(s):

Millimeter Wave ◽

Dielectric Waveguide ◽

Printed Circuit Board ◽

Circuit Board ◽

Low Loss ◽

Printed Circuit ◽

Hollow Dielectric Waveguide ◽

Planar Transition

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A strip line ring resonator method for determination of dielectric properties of printed circuit board material in function of frequency

The 17th Annual Meeting of the IEEE Lasers and Electro-Optics Society, 2004. LEOS 2004. ◽

10.1109/ceidp.2004.1364344 ◽

2004 ◽

Cited By ~ 12

Author(s):

J.-M. Heinola ◽

K.-P. Latti ◽

J.-P. Strom ◽

M. Kettunen ◽

P. Silventoinen

Keyword(s):

Dielectric Properties ◽

Printed Circuit Board ◽

Ring Resonator ◽

Circuit Board ◽

Strip Line ◽

Printed Circuit ◽

Board Material ◽

Resonator Method

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Dielectric and Hot/Wet Properties of Methyl-Silsesquioxane/Cyanate Ester Resin Hybrid Materials

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.216.630 ◽

2011 ◽

Vol 216 ◽

pp. 630-634

Author(s):

Zeng Ping Zhang ◽

Yong Wen ◽

Hong Zhao Du ◽

Jian Zhong Pei ◽

Shuan Fa Chen

Keyword(s):

Dielectric Constant ◽

Dielectric Properties ◽

Dielectric Loss ◽

High Performance ◽

Printed Circuit Board ◽

Cyanate Ester ◽

Circuit Board ◽

Printed Circuit ◽

Cyanate Ester Resin ◽

Properties Of Materials

Methylsilsesquioxane (Me-SSQ) was incorporated into cyanate ester resin (CE) to obtain organic-inorganic hybrids with better dielectric properties in this study. First, methyltriethoxysilane was hydrolyzed and condensed to synthesize Me-SSQ. Then several Me-SSQ/CE hybrids containing different contents of Me-SSQ were prepared. The effect of Me-SSQ content on the dielectric and hot/wet properties of materials was investigated. Results showed that the Me-SSQ/CE hybrid containing 20wt% of Me-SSQ shows a dielectric constant of 2.78, which is much lower than the pure CE resin. At the same time, the dielectric loss of the Me-SSQ/CE hybrids was slightly increased (tanδ<0.006). It indicates that Me-SSQ/CE hybrid is a promising matrix materials for high-performance printed circuit board (PCB).

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