RF Capacitor Material for Use in Printed Circuit Board

2013 ◽  
Vol 2013 (1) ◽  
pp. 000507-000510
Author(s):  
Jin-Hyun Hwang ◽  
John Andresakis ◽  
Ethan Feinberg ◽  
Bob Carter ◽  
Yuji Kageyama ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Temperature Stability ◽  
Dielectric Strength ◽  
Polymer Composite Material ◽  
Circuit Board ◽  
Discrete Elements ◽  
Low Loss ◽  
Printed Circuit ◽  
Material Issue ◽  
High Dielectric

A novel ceramic-functional-particle-filled polymer composite material has been developed for the use either in discrete elements on the printed circuit board or in being embedded within the packaging substrate for high frequency circuit applications. This material provides the desired properties such as low loss at high frequencies, about 0.002 or less up to 10GHz, and high dielectric strength, among other improved properties. The electrical properties were influenced significantly by the ceramic-functional-particle, i.e. type and particle size/distribution in the polymer matrix. Their contributions to the electric strength and temperature stability of capacitance which is an important material issue for practical device application will be discussed. In addition, capacitance tolerance for manufacturing embedded RF capacitor will be presented in terms of etching uniformity to minimize the variation of the capacitor electrode areas.

High dielectric multiwalled carbon nanotube-polybenzoxazine nanocomposites for printed circuit board applications

2013 ◽  
Vol 103 (15) ◽  
pp. 152902 ◽  
Author(s):  
Mohan Selvi ◽  
Muthukumaraswamy Rangaraj Vengatesan ◽  
Pichaimani Prabunathan ◽  
Jang Kun Song ◽  
Muthukaruppan Alagar
Keyword(s):  
Carbon Nanotube ◽  
Printed Circuit Board ◽  
Multiwalled Carbon Nanotube ◽  
Circuit Board ◽  
Multiwalled Carbon ◽  
Printed Circuit ◽  
High Dielectric

Fabrication and dielectric properties of BADCy/Ni0.5Ti0.5NbO4 composites for ultra-low-loss printed circuit board application

2016 ◽  
Vol 42 (1) ◽  
pp. 234-241 ◽  
Author(s):  
Biao Zhang ◽  
Feng Ye ◽  
Ye Gao ◽  
Shichao Liu ◽  
Qiang Liu ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Low Loss ◽  
Printed Circuit

Filler effect of low loss dielectricity in printed circuit board material

2007 ◽  
Vol 23 (2-4) ◽  
pp. 141-145 ◽  
Author(s):  
Jiae Lee ◽  
Hyosoon Shin ◽  
Jonghee Kim ◽  
Hogyu Yoon
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Low Loss ◽  
Printed Circuit ◽  
Board Material

Synthesis and Fabrication of Novel Polymeric/Organic Materials for Micro/Nano-Scale Optical Printed Circuit Board and VLSI Photonic Integrated Circuit Application

2007 ◽  
Vol 124-126 ◽  
pp. 459-462 ◽  
Author(s):  
El Hang Lee ◽  
In Joo Chin ◽  
Yong Ku Kwon ◽  
S.G. Lee ◽  
B.H. O ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Organic Materials ◽  
Dielectric Strength ◽  
Device Fabrication ◽  
Circuit Board ◽  
Photonic Integrated Circuit ◽  
Printed Circuit ◽  
Novel Device ◽  
Photonic Circuit

We report on the synthesis and fabrication of novel polymer/organic materials for application for what we call optical printed circuit board (O-PCB) for VLSI photonic circuit (VLSI-PIC). We synthesize copolymers containing cross-linkable pendant groups suitable for embossing and novel device fabrication. We also synthesize organic-inorganic hybrid materials of low optical absorption, good adhesion, low dielectric constant, high dielectric strength, high thermal stability, excellent photo-patterning possibility and variability of refractive index. Steps of synthesis and fabrication of these materials are described along with their optical, material, and performance characteristics. O-PCB and VLSI photonic circuit design and fabrication processes are also presented.

Flexible Optical Interconnects via Thiol-ene Two-photon-induced Polymerization

2012 ◽  
Vol 1438 ◽  
Author(s):  
Josef Kumpfmueller ◽  
Klaus Stadlmann ◽  
Zhiquan Li ◽  
Valentin Satzinger ◽  
Juergen Stampfl ◽  
...  
Keyword(s):  
Optical Interconnects ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Matrix Material ◽  
Temperature Stability ◽  
Circuit Board ◽  
High Temperature Stability ◽  
Resolution Limit ◽  
Printed Circuit ◽  
Two Photon

ABSTRACTTwo-photon polymerization (2PP) is an emerging tool in the field of additive manufacturing technologies, which allows for the elegant 3D lithographic production by means of photosensitive resins. One key advantage of 2PP is the achievable feature resolution. A few tens of nanometers are currently the resolution limit for this novel technique. Fields of applications are as diverse as photonics, microfluidics and biomedicine.A challenging photonics application for 2PP are optical interconnects, where optical elements on printed circuit boards are connected with waveguides. The possibility for real 3D structuring allows for easier positioning of the cured structures and straightforward processing outperforming techniques such as 2D lithography or reactive ion etching in this regard. If mechanical flexibility of the printed circuit board is required as a property for certain niche applications, polysiloxanes are an interesting class of matrix material. This is also due to their low optical damping behavior and high temperature stability as the material has to withstand temperatures around 250°C during the manufacturing process. In this work, we present our latest approach to create polysiloxane-based waveguides via 2PP of specially tailored thiol-ene formulations. Latest improvements on the ease of processing and the local refractive index increase are shown as well as the proof of principle for waveguiding. Optical waveguides were successfully created via 2PP with writing speeds around 10 mm/min.

scholarly journals Surge Dielectric Strength between Printed Circuit Board Conductive Foils with Solder Resist Coating.

2002 ◽  
Vol 5 (6) ◽  
pp. 609-612
Author(s):  
Yoshiyuki NAGASHIMA ◽  
Junpei BABA ◽  
Katsuhiko SYUTOH ◽  
Eisuke MASADA
Keyword(s):  
Printed Circuit Board ◽  
Dielectric Strength ◽  
Circuit Board ◽  
Printed Circuit
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