A novel dismantling process of waste printed circuit boards using water-soluble ionic liquid

Chemosphere ◽  
2013 ◽  
Vol 93 (7) ◽  
pp. 1288-1294 ◽  
Author(s):  
Xianlai Zeng ◽  
Jinhui Li ◽  
Henghua Xie ◽  
Lili Liu
2015 ◽  
Vol 41 ◽  
pp. 142-147 ◽  
Author(s):  
Mengjun Chen ◽  
Jinxiu Huang ◽  
Oladele A. Ogunseitan ◽  
Nengming Zhu ◽  
Yan-min Wang

2015 ◽  
Vol 768 ◽  
pp. 588-594 ◽  
Author(s):  
Min Xu ◽  
Jing Wei Wang ◽  
Yu Xing Mao ◽  
Hong Yong Xie

Treatment technology of brominated epoxy resin (BER) is still a big challenge to waste printed circuit boards (PCBs) recycling. In order to make full use of the materials, ionic liquid 1-butyl-3-methyl imidazole chloride ([Bmim]Cl) was used to dissolve BER to separate glass fibers from PCB nonmetallic powders. The effects of dissolving parameters including temperature, time and solid/ liquid ratio on the dissolution rate of BER were investigated. The dissolved BER were regenerated and were characterized by FTIR and thermal analysis. Results showed that [Bmim]Cl was a good direct solvent for BER dissolution and at a suitable condition of 170°Cfor 6 hours with solid/liquid ratio of 1: 20 (g/g), nearly 90% of BER in original powders were dissolved. The possible dissolution mechanism was also discussed.


Sign in / Sign up

Export Citation Format

Share Document