Investigation on Dissolution of Brominated Epoxy Resin Using Ionic Liquid [Bmim]Cl from Waste Printed Circuit Boards

Treatment technology of brominated epoxy resin (BER) is still a big challenge to waste printed circuit boards (PCBs) recycling. In order to make full use of the materials, ionic liquid 1-butyl-3-methyl imidazole chloride ([Bmim]Cl) was used to dissolve BER to separate glass fibers from PCB nonmetallic powders. The effects of dissolving parameters including temperature, time and solid/ liquid ratio on the dissolution rate of BER were investigated. The dissolved BER were regenerated and were characterized by FTIR and thermal analysis. Results showed that [Bmim]Cl was a good direct solvent for BER dissolution and at a suitable condition of 170°Cfor 6 hours with solid/liquid ratio of 1: 20 (g/g), nearly 90% of BER in original powders were dissolved. The possible dissolution mechanism was also discussed.