The transfers of brominated epoxy resins and metals during exfoliation of waste printed circuit boards with ionic liquid

2016 ◽  
Vol 55 (3) ◽  
pp. 328-337 ◽  
Author(s):  
P. Zhu ◽  
Y. Z. Yang ◽  
Z. B. Cao ◽  
L. Y. Wang ◽  
G. R. Qian ◽  
...  
Keyword(s):  
Ionic Liquid ◽  
Epoxy Resins ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards

scholarly journals Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids

2015 ◽  
Vol 41 ◽  
pp. 142-147 ◽  
Author(s):  
Mengjun Chen ◽  
Jinxiu Huang ◽  
Oladele A. Ogunseitan ◽  
Nengming Zhu ◽  
Yan-min Wang
Keyword(s):  
Ionic Liquid ◽  
Comparative Study ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Copper Leaching

Investigation on Dissolution of Brominated Epoxy Resin Using Ionic Liquid [Bmim]Cl from Waste Printed Circuit Boards

2015 ◽  
Vol 768 ◽  
pp. 588-594 ◽  
Author(s):  
Min Xu ◽  
Jing Wei Wang ◽  
Yu Xing Mao ◽  
Hong Yong Xie
Keyword(s):  
Ionic Liquid ◽  
Epoxy Resin ◽  
Printed Circuit Boards ◽  
Dissolution Mechanism ◽  
Circuit Boards ◽  
Liquid Ratio ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Brominated Epoxy Resin ◽  
Solid Liquid

Treatment technology of brominated epoxy resin (BER) is still a big challenge to waste printed circuit boards (PCBs) recycling. In order to make full use of the materials, ionic liquid 1-butyl-3-methyl imidazole chloride ([Bmim]Cl) was used to dissolve BER to separate glass fibers from PCB nonmetallic powders. The effects of dissolving parameters including temperature, time and solid/ liquid ratio on the dissolution rate of BER were investigated. The dissolved BER were regenerated and were characterized by FTIR and thermal analysis. Results showed that [Bmim]Cl was a good direct solvent for BER dissolution and at a suitable condition of 170°Cfor 6 hours with solid/liquid ratio of 1: 20 (g/g), nearly 90% of BER in original powders were dissolved. The possible dissolution mechanism was also discussed.

Dissolution of Brominated Epoxy Resins by Dimethyl Sulfoxide To Separate Waste Printed Circuit Boards

2013 ◽  
Vol 47 (6) ◽  
pp. 2654-2660 ◽  
Author(s):  
Ping Zhu ◽  
Yan Chen ◽  
Liangyou Wang ◽  
Guangren Qian ◽  
Wei Jie Zhang ◽  
...  
Keyword(s):  
Dimethyl Sulfoxide ◽  
Epoxy Resins ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards
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