Quenching induced enhancement of coupling between the molecule reorientation and grain boundary relaxation in polycrystalline C60

Inherent thermal and mechanical instability of nanograined materials bottlenecks their processing and technological applications. In addition to the traditional stabilization strategy, which is based on alloying, grain boundary relaxation was recently found to be effective in stabilizing nanograined pure metals. Grain boundary relaxation can be induced by deforming very fine nanograins below a critical size, typically several tens of nanometers. Here, we found that rapid heating may trigger intensive boundary relaxation of pure Cu nanograins with sizes up to submicrometers, a length scale with notable instability in metals. The rapidly heated Cu nanograins remain stable at temperatures as high as 0.6 Tm (melting point), even higher than the recrystallization temperature of deformed coarse-grained Cu. The thermally induced grain boundary relaxation originating from the generation of high-density nanotwins offers an alternative approach to stabilizing nanostructured materials.

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Rheo-Optical Studies on the Deformation Mechanism of Semicrystalline Polymers. V. Quantitative Analysis of Grain-Boundary Relaxation in Polyethylene

Polymer Journal ◽

10.1295/polymj.11.331 ◽

1979 ◽

Vol 11 (4) ◽

pp. 331-339 ◽

Cited By ~ 10

Author(s):

Shoji Suehiro ◽

Them Kyu ◽

Ken-ichi Fujita ◽

Hiromichi Kawai

Keyword(s):

Quantitative Analysis ◽

Grain Boundary ◽

Deformation Mechanism ◽

Semicrystalline Polymers ◽

Optical Studies ◽

Boundary Relaxation

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Progress in the Investigations of Grain Boundary Relaxation

Critical Reviews in Solid State and Material Sciences ◽

10.1080/10408436.2015.1135416 ◽

2016 ◽

Vol 41 (3) ◽

pp. 192-216 ◽

Cited By ~ 2

Author(s):

Q. P. Kong ◽

Q. F. Fang

Keyword(s):

Grain Boundary ◽

Boundary Relaxation

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Grain boundary relaxation in yellow gold bi-crystals

Materials Science and Engineering A ◽

10.1016/j.msea.2015.02.063 ◽

2015 ◽

Vol 632 ◽

pp. 43-49 ◽

Cited By ~ 4

Author(s):

Ann-Kathrin Maier ◽

Daniele Mari ◽

Iva Tkalcec ◽

Robert Schaller

Keyword(s):

Grain Boundary ◽

Boundary Relaxation

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Effect of Quenching on the Grain Boundary Relaxation in PM2000 ODS Alloy

Chinese Physics Letters ◽

10.1088/0256-307x/22/12/046 ◽

2005 ◽

Vol 22 (12) ◽

pp. 3147-3150 ◽

Cited By ~ 2

Author(s):

Gao Zhan-Yong ◽

Wu Jie ◽

Han Fu-Sheng

Keyword(s):

Grain Boundary ◽

Boundary Relaxation ◽

Ods Alloy

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Mechanical Stress, Grain-boundary Relaxation, and Oxidation of Sputtered CuNi(Mn) Films

Journal of Materials Research ◽

10.1557/jmr.1999.0175 ◽

1999 ◽

Vol 14 (4) ◽

pp. 1286-1294 ◽

Cited By ~ 9

Author(s):

W. Brückner ◽

W. Pitschke ◽

S. Baunack ◽

J. Thomas

Keyword(s):

Grain Boundary ◽

Microstructural Characterization ◽

Excess Vacancy ◽

X Ray Diffraction ◽

Force Microscopy ◽

Atomic Force ◽

Transmission Electron ◽

Boundary Relaxation ◽

20 Nm ◽

Atomic Rearrangement

This paper focuses on understanding stress development in CuNi42Mn1 thin films during annealing in Ar. In addition to stress-temperature measurements, resistance-temperature investigations and chemical and microstructural characterization by Auger electron spectroscopy, scanning and transmission electron microscopy, x-ray diffraction, and atomic force microscopy were also carried out. The films are polycrystalline with a grain size of 20 nm up to 450 °C. To explain the stress evolution above 120 °C, atomic rearrangement (excess-vacancy annihilation, grain-boundary relaxation, and shrinkage of grain-boundary voids) and oxidation were considered. Grain-boundary relaxation was found to be the dominating process up to 250–300 °C. A sharp transition from compressive to tensile stress between 300 and 380 °C is explained by the formation of a NiO surface layer due to reaction with the remaining oxygen in the Ar atmosphere. This oxidation is masking the inherent structural relaxation above 300 °C.

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