Comparison and analysis of non-destructive testing techniques suitable for delamination inspection in wind turbine blades

2011 ◽  
Vol 42 (5) ◽  
pp. 1298-1305 ◽  
Author(s):  
I. Amenabar ◽  
A. Mendikute ◽  
A. López-Arraiza ◽  
M. Lizaranzu ◽  
J. Aurrekoetxea
2018 ◽  
Vol 52 (26) ◽  
pp. 3589-3599 ◽  
Author(s):  
Muhammad Asif ◽  
Muhammad A Khan ◽  
Sohaib Z Khan ◽  
Rizwan S Choudhry ◽  
Kamran A Khan

Laminate composites are commonly used for the production of critical mechanical structures and components such as wind turbine blades, helicopter rotors, unmanned aerial vehicle wings and honeycomb structures for aircraft wings. During the manufacturing process of these composite structures, zones or areas with weak bond strength are always issues, which may affect the strength and performance of components. The identification and quantification of these zones are always challenging and necessary for the mass production. Non-destructive testing methods available, including ultrasonic A, B, and C-Scan, laser shearography, X-ray tomography, and thermography can be useful for the mentioned purposes. A comparison of these techniques concerning their capacity of identification and quantification of bond defects; however, still needs a comprehensive review. In this paper, a detailed comparison of several non-destructive testing techniques is provided. Emphasis is placed to institute a guideline to select the most suitable technique for the identification of zones with bond defects in laminated composites. Experimental tests on different composite based machined components are also discussed in detail. The discussion provides practical evidence about the effectiveness of different non-destructive testing techniques.


Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Ingrid DeWolf ◽  
Ahmad Khaled ◽  
...  

Abstract Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.


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