Mechanical, dielectric and thermal properties of polyimide films with sandwich structure

2020 ◽  
pp. 113305
Author(s):  
Panpan Zhang ◽  
Ke Zhang ◽  
Xi Chen ◽  
Shuliang Dou ◽  
Jiupeng Zhao ◽  
...  
RSC Advances ◽  
2016 ◽  
Vol 6 (26) ◽  
pp. 21662-21671 ◽  
Author(s):  
Weibing Dong ◽  
Yue Guan ◽  
Dejing Shang

To acquire low dielectric constant polyimide films with good mechanical and thermal properties and low CTE applied in microelectronic fields, three novel polyimides containing pyridine and –C(CF3)2– groups were firstly designed and synthesized.


2019 ◽  
Vol 10 (19) ◽  
pp. 2387-2396 ◽  
Author(s):  
Kan Zhang ◽  
Xinye Yu ◽  
Shiao-Wei Kuo

A high performance cross-linked polymer with a very low dielectric constant was achieved via a newly designed main-chain type poly(benzoxazine-co-imide-co-siloxane).


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