Screening of electroplating additive for improving throwing power of copper pyrophosphate bath via molecular dynamics simulation

2020 ◽  
Vol 757 ◽  
pp. 137848 ◽  
Author(s):  
Qingyang Li ◽  
Jiaping Hu ◽  
Jinqiu Zhang ◽  
Peixia Yang ◽  
Yidong Hu ◽  
...  
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