scholarly journals Marangoni stress induced by free-surface for pressure reduction in reverse osmosis

Desalination ◽  
2018 ◽  
Vol 433 ◽  
pp. 151-154 ◽  
Author(s):  
Francisco J. Arias
Author(s):  
H. K. Plummer ◽  
E. Eichen ◽  
C. D. Melvin

Much of the work reported in the literature on cellulose acetate reverse osmosis membranes has raised new and important questions with regard to the dense or “active” layer of these membranes. Several thickness values and structures have been attributed to the dense layer. To ensure the correct interpretation of the cellulose acetate structure thirteen different preparative techniques have been used in this investigation. These thirteen methods included various combinations of water substitution, freeze drying, freeze sectioning, fracturing, embedding, and microtomy techniques with both transmission and scanning electron microscope observations.It was observed that several factors can cause a distortion of the structure during sample preparation. The most obvious problem of water removal can cause swelling, shrinking, and folds. Improper removal of embedding materials, when used, can cause a loss of electron image contrast and, or structure which could hinder interpretation.


Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


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