Abstract
A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.
An improved accurate speckle projection method is used for study the mechanical properties of the composite material film in the paper. A system for deformation measurement is developed with the telecentric lenses, in which such conventional lens’ disadvantages such as lens distortion and perspective error will be diminished. Experiments are performed to validate the availability and reliability of the calibration method. The system can also be used to measure the dynamic deformation and then results are also given.