Dynamic heat transfer modeling and parametric study of thermoelectric radiant cooling and heating panel system

2016 ◽  
Vol 124 ◽  
pp. 504-516 ◽  
Author(s):  
Yongqiang Luo ◽  
Ling Zhang ◽  
Zhongbing Liu ◽  
Yingzi Wang ◽  
Jing Wu ◽  
...  
Author(s):  
Nan Zhang ◽  
Yuying Liang ◽  
Huijun Wu ◽  
Xinhua Xu ◽  
Ke Du ◽  
...  

2019 ◽  
Vol 161 ◽  
pp. 114138
Author(s):  
Nattawut Chaomuang ◽  
Onrawee Laguerre ◽  
Denis Flick

2008 ◽  
Vol 42 (6-8) ◽  
pp. 939-951 ◽  
Author(s):  
Tounsia Jamah ◽  
Rachid Mansouri ◽  
Saïd Djennoune ◽  
Maâmar Bettayeb

2019 ◽  
Vol 111 ◽  
pp. 01001
Author(s):  
Hansol Lim ◽  
Hye-Jin Cho ◽  
Seong-Yong Cheon ◽  
Soo-Jin Lee ◽  
Jae-Weon Jeong

A phase change material based radiant cooling panel with thermoelectric module (PCM-TERCP) is proposed in this study. It consists of two aluminium panels, and phase change materials (PCMs) sandwiched between the two panels. Thermoelectric modules (TEMs) are attached to one of the aluminium panels, and heat sinks are attached to the top side of TEMs. PCM-TERCP is a thermal energy storage concept equipment, in which TEMs freeze the PCM during the night whose melting temperature is 16○C. Therefore, the radiant cooling panel can maintain a surface temperature of 16◦C without the operation of TEM during the day. Furthermore, it is necessary to design the PCM-TERCP in a way that it can maintain the panel surface temperature during the targeted operating time. Therefore, the numerical model was developed using finite difference method to evaluate the thermal behaviour of PCM-TERCP. Experiments were also conducted to validate the performance of the developed model. Using the developed model, the possible operation time was investigated to determine the overall heat transfer coefficient required between radiant cooling panel and TEM. Consequently, the results showed that a overall heat transfer coefficient of 394 W/m2K is required to maintain the surface temperature between 16○C to 18○C for a 3 hours operation.


2011 ◽  
Vol 8 (2) ◽  
pp. 151-157 ◽  
Author(s):  
R. Liu ◽  
S. Guo ◽  
X. Qiu ◽  
J. Wang

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