scholarly journals Heat pipe based thermal management systems for energy-efficient data centres

Energy ◽  
2014 ◽  
Vol 77 ◽  
pp. 265-270 ◽  
Author(s):  
Hussam Jouhara ◽  
Richard Meskimmon
Author(s):  
Mohammad Moulod ◽  
Gisuk Hwang

A heat pipe has been known as a thermal superconductor utilizing a liquid-vapor phase change, and it has drawn significant attentions for advanced thermal management systems. However, a challenge is the size limitation, i.e., the heat pipe cannot be smaller than the evaporator/condenser wick structures, typically an order of micron, and a new operating mechanism is required to meet the needs for the nanoscale thermal management systems. In this study, we design the nanoscale heat pipe employing the gas-filled nanostructure, while transferring heat via ballistic fluid-particle motions with a possible returning working fluid via surface diffusions along the nanostructure. The enhanced heat flux for the nano heat pipe is demonstrated using the nonequilibrium molecular dynamics simulations (NEMDS) for the argon gas confined by the 20 nm-long Pt nanogap with a post wall with the temperature difference between the hot and cold surfaces of 20 K. The predicted results show that the maximum heat flux through the gas-filled nanostructure (heat pipe) nearly doubles that of the nanogap without the post wall at 100 < T < 140 K. The optimal operating conditions/material selections are discussed. The results for the nanogap agree with those obtained from the kinetic theory, and provide insights into the design of advanced thermal management systems.


2016 ◽  
Vol 6 (3) ◽  
Author(s):  
Nishad Deshpande ◽  
Shabib Ahmeda ◽  
Alok Khodea

The advent of cloud computing has nurtured an unprecedented growth of datacentres. With its growth, the main concern for service providers and data centre owners is toefficiently manage the energy of the data centres without compromising their computingcapabilities. This concern is genuine as data centres utilise 10-30 times more energy thanoffice spaces and also generate immense heat. As cooling accounts for half of the total powerconsumption in data centres, efficient cooling systems have become a vital need for datacentres. This has resulted in increased research and innovation in the field of efficient coolingof data centres, which in turn has led to growth in filing of patents in this domain. Patents aretechno-legal documents that contain different kinds of information that is accessible to all. Inthe present study, patents are used as source of information for competitive/businessintelligence to highlight the technological trends in the field of energy efficient cooling of datacentres. The study reveals that IBM, HP, Schneider and Hon Hai Industries are the majorplayers working in this technological area. Contrary to the notion that air conditioning wouldbe the most researched area for cooling data centres, the study reveals that there is alsointerest in the hardware of the servers and racks to produce less heat or to have built-incooling mechanisms. The main technologies for which patents are being filed includeventilation using gaseous coolant, technologies related to rack design as well as liquid cooling.Original equipment manufacturers and other vendors have increased filings, along with cloudservice providers. Most of these technologies originate from Asia-Pacific and this region is astrong market, following the USA.


2020 ◽  
Vol 65 (31) ◽  
pp. 3485-3496
Author(s):  
Yueqi Wang ◽  
Yuping Qian ◽  
Weilin Zhuge ◽  
Dan Dan ◽  
Chengning Yao ◽  
...  

2015 ◽  
pp. 191-245 ◽  
Author(s):  
Micha vor dem Berge ◽  
Jochen Buchholz ◽  
Leandro Cupertino ◽  
Georges Da Costa ◽  
Andrew Donoghue ◽  
...  

2021 ◽  
Vol 151 ◽  
pp. 111611
Author(s):  
Vima Mali ◽  
Rajat Saxena ◽  
Kundan Kumar ◽  
Abul Kalam ◽  
Brijesh Tripathi

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